JPWO2022201883A1 - - Google Patents

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Publication number
JPWO2022201883A1
JPWO2022201883A1 JP2023508739A JP2023508739A JPWO2022201883A1 JP WO2022201883 A1 JPWO2022201883 A1 JP WO2022201883A1 JP 2023508739 A JP2023508739 A JP 2023508739A JP 2023508739 A JP2023508739 A JP 2023508739A JP WO2022201883 A1 JPWO2022201883 A1 JP WO2022201883A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023508739A
Other languages
Japanese (ja)
Other versions
JPWO2022201883A5 (cg-RX-API-DMAC7.html
JP7775285B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022201883A1 publication Critical patent/JPWO2022201883A1/ja
Publication of JPWO2022201883A5 publication Critical patent/JPWO2022201883A5/ja
Priority to JP2025187325A priority Critical patent/JP2026016766A/ja
Application granted granted Critical
Publication of JP7775285B2 publication Critical patent/JP7775285B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/53—Constructional details of electronic viewfinders, e.g. rotatable or detachable
    • H04N23/531—Constructional details of electronic viewfinders, e.g. rotatable or detachable being rotatable or detachable
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Studio Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Indication In Cameras, And Counting Of Exposures (AREA)
  • Accessories Of Cameras (AREA)
JP2023508739A 2021-03-25 2022-02-01 冷却装置、および電子機器システム Active JP7775285B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025187325A JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021051662 2021-03-25
JP2021051662 2021-03-25
PCT/JP2022/003879 WO2022201883A1 (ja) 2021-03-25 2022-02-01 冷却装置、および電子機器システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025187325A Division JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Publications (3)

Publication Number Publication Date
JPWO2022201883A1 true JPWO2022201883A1 (cg-RX-API-DMAC7.html) 2022-09-29
JPWO2022201883A5 JPWO2022201883A5 (cg-RX-API-DMAC7.html) 2023-12-21
JP7775285B2 JP7775285B2 (ja) 2025-11-25

Family

ID=83396813

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023508739A Active JP7775285B2 (ja) 2021-03-25 2022-02-01 冷却装置、および電子機器システム
JP2025187325A Pending JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025187325A Pending JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Country Status (3)

Country Link
US (2) US12449721B2 (cg-RX-API-DMAC7.html)
JP (2) JP7775285B2 (cg-RX-API-DMAC7.html)
WO (1) WO2022201883A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024090237A (ja) 2022-12-22 2024-07-04 キヤノン株式会社 制御装置、撮像装置、制御方法及びプログラム
JP2025051187A (ja) * 2023-09-25 2025-04-04 パナソニックＩｐマネジメント株式会社 撮像装置および放熱ユニット
JP2025159544A (ja) * 2024-04-08 2025-10-21 キヤノン株式会社 電子機器、冷却装置、および電子機器システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211829A (ja) * 1994-01-20 1995-08-11 Sanyo Denki Co Ltd 電子部品冷却装置
JPH08162788A (ja) * 1994-12-01 1996-06-21 Pfu Ltd ファン付きヒートシンク
JPH10256446A (ja) * 1998-04-20 1998-09-25 Fujitsu Ltd ヒートシンク
JP2007180706A (ja) * 2005-12-27 2007-07-12 Sony Corp 撮像装置
JP2008277355A (ja) * 2007-04-25 2008-11-13 Toshiba Corp 冷却装置および電子機器
JP2012173591A (ja) * 2011-02-23 2012-09-10 Nikon Corp 電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019114893A (ja) 2017-12-22 2019-07-11 キヤノン株式会社 撮像装置
JP2019219493A (ja) * 2018-06-19 2019-12-26 キヤノン株式会社 電子機器
WO2020217298A1 (ja) * 2019-04-23 2020-10-29 パナソニックＩｐマネジメント株式会社 撮像装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211829A (ja) * 1994-01-20 1995-08-11 Sanyo Denki Co Ltd 電子部品冷却装置
JPH08162788A (ja) * 1994-12-01 1996-06-21 Pfu Ltd ファン付きヒートシンク
JPH10256446A (ja) * 1998-04-20 1998-09-25 Fujitsu Ltd ヒートシンク
JP2007180706A (ja) * 2005-12-27 2007-07-12 Sony Corp 撮像装置
JP2008277355A (ja) * 2007-04-25 2008-11-13 Toshiba Corp 冷却装置および電子機器
JP2012173591A (ja) * 2011-02-23 2012-09-10 Nikon Corp 電子機器

Also Published As

Publication number Publication date
US20230418137A1 (en) 2023-12-28
JP2026016766A (ja) 2026-02-03
US20260010058A1 (en) 2026-01-08
WO2022201883A1 (ja) 2022-09-29
JP7775285B2 (ja) 2025-11-25
US12449721B2 (en) 2025-10-21

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