JPWO2022196188A1 - - Google Patents
Info
- Publication number
- JPWO2022196188A1 JPWO2022196188A1 JP2023506864A JP2023506864A JPWO2022196188A1 JP WO2022196188 A1 JPWO2022196188 A1 JP WO2022196188A1 JP 2023506864 A JP2023506864 A JP 2023506864A JP 2023506864 A JP2023506864 A JP 2023506864A JP WO2022196188 A1 JPWO2022196188 A1 JP WO2022196188A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021041900 | 2021-03-15 | ||
| PCT/JP2022/004899 WO2022196188A1 (ja) | 2021-03-15 | 2022-02-08 | 撮像装置、撮像装置の製造方法、および電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022196188A1 true JPWO2022196188A1 (zh) | 2022-09-22 |
Family
ID=83322259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506864A Pending JPWO2022196188A1 (zh) | 2021-03-15 | 2022-02-08 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022196188A1 (zh) |
| WO (1) | WO2022196188A1 (zh) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4237966B2 (ja) * | 2002-03-08 | 2009-03-11 | 浜松ホトニクス株式会社 | 検出器 |
| JP2005191157A (ja) * | 2003-12-25 | 2005-07-14 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP4395775B2 (ja) * | 2005-10-05 | 2010-01-13 | ソニー株式会社 | 半導体装置及びその製造方法 |
| JP2012204403A (ja) * | 2011-03-23 | 2012-10-22 | Toshiba Corp | 固体撮像装置及びその製造方法 |
| TWI788430B (zh) * | 2017-10-30 | 2023-01-01 | 日商索尼半導體解決方案公司 | 背面照射型之固體攝像裝置、背面照射型之固體攝像裝置之製造方法、攝像裝置及電子機器 |
| KR102483548B1 (ko) * | 2017-10-31 | 2023-01-02 | 삼성전자주식회사 | 이미지 센싱 장치 |
| CN112640112A (zh) * | 2018-10-15 | 2021-04-09 | 索尼半导体解决方案公司 | 固体摄像装置和电子设备 |
| TW202101744A (zh) * | 2018-12-20 | 2021-01-01 | 日商索尼半導體解決方案公司 | 背面照射型固體攝像裝置、背面照射型固體攝像裝置之製造方法、攝像裝置及電子機器 |
-
2022
- 2022-02-08 WO PCT/JP2022/004899 patent/WO2022196188A1/ja active Application Filing
- 2022-02-08 JP JP2023506864A patent/JPWO2022196188A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022196188A1 (ja) | 2022-09-22 |