JPWO2022181764A1 - - Google Patents

Info

Publication number
JPWO2022181764A1
JPWO2022181764A1 JP2023502537A JP2023502537A JPWO2022181764A1 JP WO2022181764 A1 JPWO2022181764 A1 JP WO2022181764A1 JP 2023502537 A JP2023502537 A JP 2023502537A JP 2023502537 A JP2023502537 A JP 2023502537A JP WO2022181764 A1 JPWO2022181764 A1 JP WO2022181764A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023502537A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022181764A1 publication Critical patent/JPWO2022181764A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2023502537A 2021-02-26 2022-02-25 Pending JPWO2022181764A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021029644 2021-02-26
PCT/JP2022/007881 WO2022181764A1 (ja) 2021-02-26 2022-02-25 積層構造体およびフレキシブルプリント配線板

Publications (1)

Publication Number Publication Date
JPWO2022181764A1 true JPWO2022181764A1 (ko) 2022-09-01

Family

ID=83047534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502537A Pending JPWO2022181764A1 (ko) 2021-02-26 2022-02-25

Country Status (4)

Country Link
JP (1) JPWO2022181764A1 (ko)
KR (1) KR20230151977A (ko)
CN (1) CN116847983A (ko)
WO (1) WO2022181764A1 (ko)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004157419A (ja) 2002-11-08 2004-06-03 Tamura Kaken Co Ltd 感光性樹脂組成物及び電子部品搭載用回路基板の製造方法
JP2004361529A (ja) * 2003-06-03 2004-12-24 Mitsui Chemicals Inc ハードディスクドライブサスペンション基板用ドライフィルム
JP2013076833A (ja) 2011-09-30 2013-04-25 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物とその硬化物、及び感光性樹脂の製造方法
JP6474989B2 (ja) * 2014-10-17 2019-02-27 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
KR102286107B1 (ko) * 2015-04-08 2021-08-04 아사히 가세이 가부시키가이샤 감광성 수지 조성물
JP2018082184A (ja) * 2017-12-06 2018-05-24 味の素株式会社 樹脂シート
KR102223837B1 (ko) * 2018-06-21 2021-03-04 주식회사 엘지화학 가지형 공중합체, 이를 이용한 감광성 수지 조성물, 감광성 수지 필름 및 광학 장치
JP2019219631A (ja) * 2018-06-22 2019-12-26 日立化成株式会社 転写フィルム、硬化膜及びその形成方法、並びに、電子部品

Also Published As

Publication number Publication date
KR20230151977A (ko) 2023-11-02
WO2022181764A1 (ja) 2022-09-01
CN116847983A (zh) 2023-10-03

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Legal Events

Date Code Title Description
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Effective date: 20230605