JPWO2022176695A1 - - Google Patents

Info

Publication number
JPWO2022176695A1
JPWO2022176695A1 JP2023500756A JP2023500756A JPWO2022176695A1 JP WO2022176695 A1 JPWO2022176695 A1 JP WO2022176695A1 JP 2023500756 A JP2023500756 A JP 2023500756A JP 2023500756 A JP2023500756 A JP 2023500756A JP WO2022176695 A1 JPWO2022176695 A1 JP WO2022176695A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023500756A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176695A1 publication Critical patent/JPWO2022176695A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2023500756A 2021-02-19 2022-02-08 Pending JPWO2022176695A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021025018 2021-02-19
PCT/JP2022/004829 WO2022176695A1 (ja) 2021-02-19 2022-02-08 基板処理装置及び液体誘導部材

Publications (1)

Publication Number Publication Date
JPWO2022176695A1 true JPWO2022176695A1 (ja) 2022-08-25

Family

ID=82930867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500756A Pending JPWO2022176695A1 (ja) 2021-02-19 2022-02-08

Country Status (4)

Country Link
JP (1) JPWO2022176695A1 (ja)
KR (1) KR20230145583A (ja)
CN (1) CN116848620A (ja)
WO (1) WO2022176695A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH029124A (ja) * 1988-06-28 1990-01-12 Nec Kyushu Ltd 半導体基板の水洗装置
US5044559A (en) * 1988-11-02 1991-09-03 United Technologies Corporation Gas assisted liquid atomizer
JP4884057B2 (ja) * 2006-04-11 2012-02-22 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP6788542B2 (ja) 2017-03-31 2020-11-25 東京エレクトロン株式会社 基板液処理装置

Also Published As

Publication number Publication date
CN116848620A (zh) 2023-10-03
KR20230145583A (ko) 2023-10-17
WO2022176695A1 (ja) 2022-08-25

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230807