JPWO2022168858A1 - - Google Patents
Info
- Publication number
- JPWO2022168858A1 JPWO2022168858A1 JP2022579573A JP2022579573A JPWO2022168858A1 JP WO2022168858 A1 JPWO2022168858 A1 JP WO2022168858A1 JP 2022579573 A JP2022579573 A JP 2022579573A JP 2022579573 A JP2022579573 A JP 2022579573A JP WO2022168858 A1 JPWO2022168858 A1 JP WO2022168858A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021016868 | 2021-02-04 | ||
| PCT/JP2022/004018 WO2022168858A1 (ja) | 2021-02-04 | 2022-02-02 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022168858A1 true JPWO2022168858A1 (https=) | 2022-08-11 |
Family
ID=82741557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022579573A Pending JPWO2022168858A1 (https=) | 2021-02-04 | 2022-02-02 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240117219A1 (https=) |
| JP (1) | JPWO2022168858A1 (https=) |
| TW (1) | TW202233797A (https=) |
| WO (1) | WO2022168858A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4410923A4 (en) * | 2021-09-30 | 2025-10-01 | Fujimi Inc | POLISHING COMPOSITION |
| WO2025205562A1 (ja) * | 2024-03-28 | 2025-10-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018174008A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2019138846A1 (ja) * | 2018-01-11 | 2019-07-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2020527612A (ja) * | 2017-05-25 | 2020-09-10 | サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティドＳａｉｎｔ−Ｇｏｂａｉｎ Ｃｅｒａｍｉｃｓ Ａｎｄ Ｐｌａｓｔｉｃｓ， Ｉｎｃ． | セラミック材料の化学機械研磨のための酸化流体 |
-
2022
- 2022-02-02 WO PCT/JP2022/004018 patent/WO2022168858A1/ja not_active Ceased
- 2022-02-02 US US18/275,321 patent/US20240117219A1/en active Pending
- 2022-02-02 JP JP2022579573A patent/JPWO2022168858A1/ja active Pending
- 2022-02-07 TW TW111104391A patent/TW202233797A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018174008A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2020527612A (ja) * | 2017-05-25 | 2020-09-10 | サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティドＳａｉｎｔ−Ｇｏｂａｉｎ Ｃｅｒａｍｉｃｓ Ａｎｄ Ｐｌａｓｔｉｃｓ， Ｉｎｃ． | セラミック材料の化学機械研磨のための酸化流体 |
| WO2019138846A1 (ja) * | 2018-01-11 | 2019-07-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022168858A1 (ja) | 2022-08-11 |
| TW202233797A (zh) | 2022-09-01 |
| US20240117219A1 (en) | 2024-04-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240919 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251127 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20260116 |