TW202233797A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

Info

Publication number
TW202233797A
TW202233797A TW111104391A TW111104391A TW202233797A TW 202233797 A TW202233797 A TW 202233797A TW 111104391 A TW111104391 A TW 111104391A TW 111104391 A TW111104391 A TW 111104391A TW 202233797 A TW202233797 A TW 202233797A
Authority
TW
Taiwan
Prior art keywords
polishing
less
metal salt
acid
polishing composition
Prior art date
Application number
TW111104391A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤康昭
織田博之
中貝雄一郎
井出匠学
人
高見信一郎
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202233797A publication Critical patent/TW202233797A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW111104391A 2021-02-04 2022-02-07 研磨用組成物 TW202233797A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021016868 2021-02-04
JP2021-016868 2021-02-04

Publications (1)

Publication Number Publication Date
TW202233797A true TW202233797A (zh) 2022-09-01

Family

ID=82741557

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111104391A TW202233797A (zh) 2021-02-04 2022-02-07 研磨用組成物

Country Status (4)

Country Link
US (1) US20240117219A1 (https=)
JP (1) JPWO2022168858A1 (https=)
TW (1) TW202233797A (https=)
WO (1) WO2022168858A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4410923A4 (en) * 2021-09-30 2025-10-01 Fujimi Inc POLISHING COMPOSITION
WO2025205562A1 (ja) * 2024-03-28 2025-10-02 株式会社フジミインコーポレーテッド 研磨用組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3604475B1 (en) * 2017-03-23 2025-06-04 Fujimi Incorporated Polishing composition
KR102337333B1 (ko) * 2017-05-25 2021-12-13 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 세라믹 재료의 화학기계적 연마를 위한 산화 유체
US11339311B2 (en) * 2018-01-11 2022-05-24 Fujimi Incorporated Polishing composition

Also Published As

Publication number Publication date
WO2022168858A1 (ja) 2022-08-11
JPWO2022168858A1 (https=) 2022-08-11
US20240117219A1 (en) 2024-04-11

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