JPWO2022163599A1 - - Google Patents
Info
- Publication number
- JPWO2022163599A1 JPWO2022163599A1 JP2022578382A JP2022578382A JPWO2022163599A1 JP WO2022163599 A1 JPWO2022163599 A1 JP WO2022163599A1 JP 2022578382 A JP2022578382 A JP 2022578382A JP 2022578382 A JP2022578382 A JP 2022578382A JP WO2022163599 A1 JPWO2022163599 A1 JP WO2022163599A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021013864 | 2021-01-29 | ||
| PCT/JP2022/002491 WO2022163599A1 (ja) | 2021-01-29 | 2022-01-25 | 電子素子実装用基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022163599A1 true JPWO2022163599A1 (ja) | 2022-08-04 |
Family
ID=82654536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022578382A Pending JPWO2022163599A1 (ja) | 2021-01-29 | 2022-01-25 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022163599A1 (ja) |
| CN (1) | CN116830259A (ja) |
| WO (1) | WO2022163599A1 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04103150A (ja) * | 1990-08-23 | 1992-04-06 | Mitsubishi Materials Corp | Ｉｃ実装構造 |
| US10672697B2 (en) * | 2015-07-28 | 2020-06-02 | Kyocera Corporation | Wiring board and electronic package |
| US10741413B2 (en) * | 2016-05-12 | 2020-08-11 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |
| JP6849425B2 (ja) * | 2016-12-22 | 2021-03-24 | 京セラ株式会社 | 電子装置および電子モジュール |
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2022
- 2022-01-25 WO PCT/JP2022/002491 patent/WO2022163599A1/ja active Application Filing
- 2022-01-25 CN CN202280011213.7A patent/CN116830259A/zh active Pending
- 2022-01-25 JP JP2022578382A patent/JPWO2022163599A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022163599A1 (ja) | 2022-08-04 |
| CN116830259A (zh) | 2023-09-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230725 |