JPWO2022163574A1 - - Google Patents

Info

Publication number
JPWO2022163574A1
JPWO2022163574A1 JP2022578361A JP2022578361A JPWO2022163574A1 JP WO2022163574 A1 JPWO2022163574 A1 JP WO2022163574A1 JP 2022578361 A JP2022578361 A JP 2022578361A JP 2022578361 A JP2022578361 A JP 2022578361A JP WO2022163574 A1 JPWO2022163574 A1 JP WO2022163574A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022578361A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022163574A1 publication Critical patent/JPWO2022163574A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
JP2022578361A 2021-01-28 2022-01-24 Pending JPWO2022163574A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021012421 2021-01-28
PCT/JP2022/002423 WO2022163574A1 (ja) 2021-01-28 2022-01-24 配線基板

Publications (1)

Publication Number Publication Date
JPWO2022163574A1 true JPWO2022163574A1 (ja) 2022-08-04

Family

ID=82653522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022578361A Pending JPWO2022163574A1 (ja) 2021-01-28 2022-01-24

Country Status (4)

Country Link
EP (1) EP4286077A1 (ja)
JP (1) JPWO2022163574A1 (ja)
CN (1) CN116710220A (ja)
WO (1) WO2022163574A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000244123A (ja) * 1999-02-19 2000-09-08 Hitachi Ltd 多層セラミック回路基板
JP2001202823A (ja) * 2000-01-20 2001-07-27 Hitachi Ltd 厚膜ペースト及びセラミック回路基板
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP6624282B2 (ja) * 2016-04-28 2019-12-25 株式会社村田製作所 多層セラミック基板

Also Published As

Publication number Publication date
EP4286077A1 (en) 2023-12-06
CN116710220A (zh) 2023-09-05
WO2022163574A1 (ja) 2022-08-04

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