JPWO2022158596A1 - - Google Patents
Info
- Publication number
- JPWO2022158596A1 JPWO2022158596A1 JP2022576773A JP2022576773A JPWO2022158596A1 JP WO2022158596 A1 JPWO2022158596 A1 JP WO2022158596A1 JP 2022576773 A JP2022576773 A JP 2022576773A JP 2022576773 A JP2022576773 A JP 2022576773A JP WO2022158596 A1 JPWO2022158596 A1 JP WO2022158596A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021009883 | 2021-01-25 | ||
PCT/JP2022/002470 WO2022158596A1 (ja) | 2021-01-25 | 2022-01-24 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022158596A1 true JPWO2022158596A1 (ja) | 2022-07-28 |
Family
ID=82548760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022576773A Pending JPWO2022158596A1 (ja) | 2021-01-25 | 2022-01-24 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022158596A1 (ja) |
WO (1) | WO2022158596A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03236280A (ja) * | 1990-02-14 | 1991-10-22 | Hitachi Ltd | 半導体装置 |
JP2009254158A (ja) * | 2008-04-08 | 2009-10-29 | Toyota Motor Corp | スイッチング装置 |
JP2011108684A (ja) * | 2009-11-12 | 2011-06-02 | Sumitomo Electric Ind Ltd | 半導体装置 |
JP6024177B2 (ja) * | 2012-04-24 | 2016-11-09 | 富士電機株式会社 | パワー半導体モジュール |
JP6007578B2 (ja) * | 2012-05-10 | 2016-10-12 | 富士電機株式会社 | パワー半導体モジュールおよびその組立方法 |
-
2022
- 2022-01-24 WO PCT/JP2022/002470 patent/WO2022158596A1/ja active Application Filing
- 2022-01-24 JP JP2022576773A patent/JPWO2022158596A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022158596A1 (ja) | 2022-07-28 |