JPWO2022158385A1 - - Google Patents

Info

Publication number
JPWO2022158385A1
JPWO2022158385A1 JP2022534328A JP2022534328A JPWO2022158385A1 JP WO2022158385 A1 JPWO2022158385 A1 JP WO2022158385A1 JP 2022534328 A JP2022534328 A JP 2022534328A JP 2022534328 A JP2022534328 A JP 2022534328A JP WO2022158385 A1 JPWO2022158385 A1 JP WO2022158385A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022534328A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022158385A1 publication Critical patent/JPWO2022158385A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2022534328A 2021-01-20 2022-01-14 Pending JPWO2022158385A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021007427 2021-01-20
PCT/JP2022/001089 WO2022158385A1 (ja) 2021-01-20 2022-01-14 樹脂組成物および電気電子部品封止体

Publications (1)

Publication Number Publication Date
JPWO2022158385A1 true JPWO2022158385A1 (enExample) 2022-07-28

Family

ID=82549020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534328A Pending JPWO2022158385A1 (enExample) 2021-01-20 2022-01-14

Country Status (3)

Country Link
JP (1) JPWO2022158385A1 (enExample)
TW (1) TW202237742A (enExample)
WO (1) WO2022158385A1 (enExample)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064506A (ja) * 1999-08-25 2001-03-13 Kuraray Co Ltd 熱可塑性ポリウレタン組成物
JP2004083918A (ja) * 2001-09-18 2004-03-18 Toyobo Co Ltd モールディング用ポリエステル樹脂、樹脂組成物及びそれを用いた成型品
JP2004277559A (ja) * 2003-03-14 2004-10-07 Toyobo Co Ltd モールディング用ポリエステル樹脂、樹脂組成物及びそれらを用いた成型品
JP2012180385A (ja) * 2011-02-28 2012-09-20 Toyobo Co Ltd 樹脂組成物、該樹脂組成物を用いた電気電子部品封止体ならびにその製造方法
JP2013060539A (ja) * 2011-09-14 2013-04-04 Toyobo Co Ltd 樹脂組成物、及びそれを用いてなる金属被覆体
JP2019151755A (ja) * 2018-03-05 2019-09-12 東洋鋼鈑株式会社 パール調光沢フィルム
WO2020059834A1 (ja) * 2018-09-21 2020-03-26 三菱エンジニアリングプラスチックス株式会社 樹脂金属複合体及びその製造方法
JP2022534330A (ja) * 2019-05-30 2022-07-29 オラクル・インターナショナル・コーポレイション 在庫割り当ておよび価格決め最適化システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6183083B2 (ja) * 2012-09-13 2017-08-23 東洋紡株式会社 金属被覆用樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064506A (ja) * 1999-08-25 2001-03-13 Kuraray Co Ltd 熱可塑性ポリウレタン組成物
JP2004083918A (ja) * 2001-09-18 2004-03-18 Toyobo Co Ltd モールディング用ポリエステル樹脂、樹脂組成物及びそれを用いた成型品
JP2004277559A (ja) * 2003-03-14 2004-10-07 Toyobo Co Ltd モールディング用ポリエステル樹脂、樹脂組成物及びそれらを用いた成型品
JP2012180385A (ja) * 2011-02-28 2012-09-20 Toyobo Co Ltd 樹脂組成物、該樹脂組成物を用いた電気電子部品封止体ならびにその製造方法
JP2013060539A (ja) * 2011-09-14 2013-04-04 Toyobo Co Ltd 樹脂組成物、及びそれを用いてなる金属被覆体
JP2019151755A (ja) * 2018-03-05 2019-09-12 東洋鋼鈑株式会社 パール調光沢フィルム
WO2020059834A1 (ja) * 2018-09-21 2020-03-26 三菱エンジニアリングプラスチックス株式会社 樹脂金属複合体及びその製造方法
JP2022534330A (ja) * 2019-05-30 2022-07-29 オラクル・インターナショナル・コーポレイション 在庫割り当ておよび価格決め最適化システム

Also Published As

Publication number Publication date
WO2022158385A1 (ja) 2022-07-28
TW202237742A (zh) 2022-10-01

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