JPWO2022138630A1 - - Google Patents

Info

Publication number
JPWO2022138630A1
JPWO2022138630A1 JP2022571492A JP2022571492A JPWO2022138630A1 JP WO2022138630 A1 JPWO2022138630 A1 JP WO2022138630A1 JP 2022571492 A JP2022571492 A JP 2022571492A JP 2022571492 A JP2022571492 A JP 2022571492A JP WO2022138630 A1 JPWO2022138630 A1 JP WO2022138630A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022571492A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138630A1 publication Critical patent/JPWO2022138630A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
JP2022571492A 2020-12-25 2021-12-21 Pending JPWO2022138630A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020217826 2020-12-25
PCT/JP2021/047292 WO2022138630A1 (ja) 2020-12-25 2021-12-21 転写フィルム、積層体の製造方法、回路配線の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022138630A1 true JPWO2022138630A1 (ja) 2022-06-30

Family

ID=82159398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022571492A Pending JPWO2022138630A1 (ja) 2020-12-25 2021-12-21

Country Status (4)

Country Link
JP (1) JPWO2022138630A1 (ja)
CN (1) CN116981996A (ja)
TW (1) TW202240291A (ja)
WO (1) WO2022138630A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6482206B2 (ja) * 2014-08-22 2019-03-13 キヤノン株式会社 中空構造を有するパターンの形成方法
JPWO2016167228A1 (ja) * 2015-04-15 2018-02-08 日立化成株式会社 感光性導電フィルム、導電パターンの形成方法、導電パターン付き基材、及びタッチパネルセンサ
JP6869095B2 (ja) * 2017-04-28 2021-05-12 富士フイルム株式会社 転写材料、転写材料の製造方法、パターンの形成方法、及び金属パターンの形成方法
JP6995865B2 (ja) * 2017-08-28 2022-01-17 富士フイルム株式会社 感光性転写材料の製造方法、及び、回路配線の製造方法
JPWO2020137284A1 (ja) * 2018-12-27 2021-11-04 富士フイルム株式会社 導電性転写材料、パターンつき基板の製造方法、回路基板の製造方法、積層体、及びタッチパネル

Also Published As

Publication number Publication date
TW202240291A (zh) 2022-10-16
CN116981996A (zh) 2023-10-31
WO2022138630A1 (ja) 2022-06-30

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