JPWO2022137277A1 - - Google Patents

Info

Publication number
JPWO2022137277A1
JPWO2022137277A1 JP2021517503A JP2021517503A JPWO2022137277A1 JP WO2022137277 A1 JPWO2022137277 A1 JP WO2022137277A1 JP 2021517503 A JP2021517503 A JP 2021517503A JP 2021517503 A JP2021517503 A JP 2021517503A JP WO2022137277 A1 JPWO2022137277 A1 JP WO2022137277A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021517503A
Other languages
Japanese (ja)
Other versions
JP6899041B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP6899041B1 publication Critical patent/JP6899041B1/ja
Publication of JPWO2022137277A1 publication Critical patent/JPWO2022137277A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2021517503A 2020-12-21 2020-12-21 めっき装置及びめっき液の撹拌方法 Active JP6899041B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/047645 WO2022137277A1 (ja) 2020-12-21 2020-12-21 めっき装置及びめっき液の撹拌方法

Publications (2)

Publication Number Publication Date
JP6899041B1 JP6899041B1 (ja) 2021-07-07
JPWO2022137277A1 true JPWO2022137277A1 (ko) 2022-06-30

Family

ID=76650045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021517503A Active JP6899041B1 (ja) 2020-12-21 2020-12-21 めっき装置及びめっき液の撹拌方法

Country Status (5)

Country Link
US (1) US20220396896A1 (ko)
JP (1) JP6899041B1 (ko)
KR (1) KR102333344B1 (ko)
CN (1) CN114981485B (ko)
WO (1) WO2022137277A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102407356B1 (ko) * 2021-03-10 2022-06-13 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기포 제거 방법
WO2022264353A1 (ja) * 2021-06-17 2022-12-22 株式会社荏原製作所 抵抗体、及び、めっき装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205696A (ja) * 1989-02-01 1990-08-15 Seiko Instr Inc 半導体ウエハのめっき装置
KR100597024B1 (ko) * 1998-03-02 2006-07-04 가부시키가이샤 에바라 세이사꾸쇼 기판의 도금장치
JP3331332B2 (ja) * 1999-08-25 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
JP2001316867A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
JP4189876B2 (ja) * 2003-03-04 2008-12-03 株式会社荏原製作所 基板処理装置
US20040182715A1 (en) * 2003-03-20 2004-09-23 Jeffrey Bogart Process and apparatus for air bubble removal during electrochemical processing
US7390382B2 (en) 2003-07-01 2008-06-24 Semitool, Inc. Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
JP2005089812A (ja) * 2003-09-17 2005-04-07 Casio Comput Co Ltd めっき装置および半導体基板のめっき方法
US8082932B2 (en) * 2004-03-12 2011-12-27 Applied Materials, Inc. Single side workpiece processing
US7276743B2 (en) * 2004-05-13 2007-10-02 Applied Materials, Inc. Retaining ring with conductive portion
JP2006028629A (ja) * 2004-07-21 2006-02-02 Electroplating Eng Of Japan Co めっき方法及びめっき装置
US7931786B2 (en) * 2005-11-23 2011-04-26 Semitool, Inc. Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
JP4509968B2 (ja) * 2006-05-25 2010-07-21 株式会社荏原製作所 めっき装置
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
US20090061617A1 (en) * 2007-09-04 2009-03-05 Alain Duboust Edge bead removal process with ecmp technology
JP5184308B2 (ja) 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
KR100990029B1 (ko) * 2008-07-25 2010-10-26 주식회사 케이씨텍 기판도금장치
KR20110067277A (ko) * 2009-12-14 2011-06-22 주식회사 케이씨텍 기판도금장치
JP5841431B2 (ja) * 2010-01-22 2016-01-13 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US9404194B2 (en) * 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
CN104220648B (zh) * 2012-04-20 2017-09-05 株式会社Ｊｃｕ 基板镀敷夹具以及利用它的镀敷装置
KR101426373B1 (ko) * 2012-09-14 2014-08-05 주식회사 케이씨텍 기판 도금 장치
JP6131162B2 (ja) * 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9481942B2 (en) * 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
US10037902B2 (en) * 2015-03-27 2018-07-31 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method

Also Published As

Publication number Publication date
US20220396896A1 (en) 2022-12-15
CN114981485A (zh) 2022-08-30
WO2022137277A1 (ja) 2022-06-30
CN114981485B (zh) 2023-03-28
JP6899041B1 (ja) 2021-07-07
KR102333344B1 (ko) 2021-12-01

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