JPWO2022130921A5 - - Google Patents

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JPWO2022130921A5
JPWO2022130921A5 JP2022569817A JP2022569817A JPWO2022130921A5 JP WO2022130921 A5 JPWO2022130921 A5 JP WO2022130921A5 JP 2022569817 A JP2022569817 A JP 2022569817A JP 2022569817 A JP2022569817 A JP 2022569817A JP WO2022130921 A5 JPWO2022130921 A5 JP WO2022130921A5
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compound
unsaturated group
polymerizable
polymerizable unsaturated
general formula
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JP7288233B2 (en
JPWO2022130921A1 (en
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Priority claimed from PCT/JP2021/043093 external-priority patent/WO2022130921A1/en
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下記一般式（１）で表される重合性化合物。
Figure 2022130921000001
 ［上記一般式（１）中、Ｘは芳香環構造及び重合性不飽和基を有する構造部位を示す。また、上記一般式（１）中の３つのＸはそれぞれ同一構造であってもよいし、異なっていてもよい。］ A polymerizable compound represented by the following general formula (1).
Figure 2022130921000001
 [In the above general formula (1), X represents a structural site having an aromatic ring structure and a polymerizable unsaturated group. Also, three X's in the general formula (1) may have the same structure or may be different. ] 前記一般式（１）中のＸが下記一般式（２－１）、（２－２）、（２－３）、又は（２－４）で表される構造部位である請求項１に記載の重合性化合物。
Figure 2022130921000002
 ［上記一般式（２－１）～（２－４）中、Ｙは直接結合、エーテル結合、又はアミド結合であり、Ｚは重合性不飽和基を有する構造部位であり、Ｒ１は脂肪族炭化水素基、アルコキシ基、又はハロゲン原子である。前記構造式中、ｍは１～５の整数、ｎは０～４の整数であり、ｍ＋ｎは５以下である。ｐは１～７の整数であり、ｑは０～６の整数であり、ｐ＋ｑは７以下である。上記一般式（２－１）～（２－４）中に複数存在するＲ１及び（Ｙ－Ｚ）基はそれぞれ同一であってもよいし、異なっていてもよい。上記一般式（２－２）及び（２－４）において、Ｒ１及び（Ｙ－Ｚ）基はナフタレン環のいずれの炭素原子に結合していてもよい。］ According to claim 1, wherein X in the general formula (1) is a structural moiety represented by the following general formula (2-1), (2-2), (2-3), or (2-4). Polymerizable compound of.
Figure 2022130921000002
 [In the above general formulas (2-1) to (2-4), Y is a direct bond, an ether bond, or an amide bond, Z is a structural moiety having a polymerizable unsaturated group, and R is an aliphatic carbonized It is a hydrogen group, an alkoxy group, or a halogen atom. In the structural formula, m is an integer of 1 to 5, n is an integer of 0 to 4, and m+n is 5 or less. p is an integer of 1 to 7, q is an integer of 0 to 6, and p+q is 7 or less. Plural R 1 and (YZ) groups present in the general formulas (2-1) to (2-4) may be the same or different. In general formulas (2-2) and (2-4) above, the R 1 and (YZ) groups may be bonded to any carbon atom of the naphthalene ring. ] トリヒドロキシベンゼンとエピハロヒドリンとの反応生成物（Ａ）と、重合性不飽和基含有芳香族化合物（Ｂ）とを反応原料とする請求項１又は２に記載の重合性化合物。 3. The polymerizable compound according to claim 1, wherein the reaction product (A) of trihydroxybenzene and epihalohydrin and the polymerizable unsaturated group-containing aromatic compound (B) are used as reaction raw materials. 前記重合性不飽和基含有芳香族化合物（Ｂ）が、重合性不飽和基含有フェノール性化合物（Ｂ１）又は重合性不飽和基含有芳香族カルボン酸化合物（Ｂ２）である請求項３に記載の重合性化合物。 4. The polymerizable unsaturated group-containing aromatic compound (B) according to claim 3, which is a polymerizable unsaturated group-containing phenolic compound (B1) or a polymerizable unsaturated group-containing aromatic carboxylic acid compound (B2). Polymerizable compound. トリヒドロキシベンゼンとエピハロヒドリンとの反応生成物（Ａ）、重合性不飽和基含有非芳香族化合物（Ｃ）、及び、前記反応生成物（Ａ）と前記重合性不飽和基含有非芳香族化合物（Ｃ）を結節する芳香族化合物（Ｄ）を反応原料とする請求項１又は２に記載の重合性化合物。 A reaction product (A) of trihydroxybenzene and epihalohydrin, a polymerizable unsaturated group-containing non-aromatic compound (C), and the reaction product (A) and the polymerizable unsaturated group-containing non-aromatic compound ( 3. The polymerizable compound according to claim 1 or 2, wherein the aromatic compound (D) connecting C) is used as a reaction raw material. 前記重合性不飽和基含有非芳香族化合物（Ｃ）が、重合性不飽和基含有脂肪族ハロゲン化物（Ｃ１）であり、前記芳香族化合物（Ｄ）がカルボキシ基を有するフェノール性化合物（Ｄ１）である請求項５に記載の重合性化合物。 The polymerizable unsaturated group-containing non-aromatic compound (C) is a polymerizable unsaturated group-containing aliphatic halide (C1), and the aromatic compound (D) is a phenolic compound (D1) having a carboxy group. The polymerizable compound according to claim 5, which is 請求項１～６のいずれか１項に記載の重合性化合物、
光重合開始剤、及び
有機溶剤を含有する、活性エネルギー線硬化性樹脂組成物。 The polymerizable compound according to any one of claims 1 to 6,
An active energy ray-curable resin composition containing a photopolymerization initiator and an organic solvent. 請求項７に記載の活性エネルギー線硬化性樹脂組成物の硬化物。 A cured product of the active energy ray-curable resin composition according to claim 7 . 請求項１～６のいずれか１項に記載の重合性化合物を含有するレジスト用組成物。 A resist composition containing the polymerizable compound according to any one of claims 1 to 6. 請求項９に記載のレジスト用組成物を硬化したレジスト膜。 A resist film obtained by curing the resist composition according to claim 9 .
JP2022569817A 2020-12-15 2021-11-25 Polymerizable compound, active energy ray-curable resin composition, cured product, resist composition, and resist film Active JP7288233B2 (en)

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JP2020207389 2020-12-15
JP2020207389 2020-12-15
PCT/JP2021/043093 WO2022130921A1 (en) 2020-12-15 2021-11-25 Polymerizable compound, active energy ray-curable resin composition, cured product, composition for resist, and resist film

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JPWO2022130921A5 true JPWO2022130921A5 (en) 2023-02-24
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CN (1) CN116670184A (en)
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JP2000007758A (en) * 1998-06-27 2000-01-11 Nagase Chiba Kk Liquid epoxy resin composition capable of being converted into b-stage
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JP2010285403A (en) 2009-06-15 2010-12-24 Nissan Chem Ind Ltd Crosslinking agent and crosslinking agent-containing composition for forming lower layer of resist film
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