JPWO2022130751A1 - - Google Patents
Info
- Publication number
- JPWO2022130751A1 JPWO2022130751A1 JP2022569730A JP2022569730A JPWO2022130751A1 JP WO2022130751 A1 JPWO2022130751 A1 JP WO2022130751A1 JP 2022569730 A JP2022569730 A JP 2022569730A JP 2022569730 A JP2022569730 A JP 2022569730A JP WO2022130751 A1 JPWO2022130751 A1 JP WO2022130751A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020209373 | 2020-12-17 | ||
PCT/JP2021/037480 WO2022130751A1 (ja) | 2020-12-17 | 2021-10-08 | 状態推定装置、実装システム、および状態推定方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022130751A1 true JPWO2022130751A1 (ja) | 2022-06-23 |
Family
ID=82059415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022569730A Pending JPWO2022130751A1 (ja) | 2020-12-17 | 2021-10-08 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022130751A1 (ja) |
WO (1) | WO2022130751A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3785887B2 (ja) * | 2000-02-17 | 2006-06-14 | 松下電器産業株式会社 | 電子部品実装方法 |
JP4674220B2 (ja) * | 2007-03-05 | 2011-04-20 | ヤマハ発動機株式会社 | 部品移載装置、表面実装機、及び電子部品検査装置 |
JP4809287B2 (ja) * | 2007-05-11 | 2011-11-09 | パナソニック株式会社 | 設備状態監視方法 |
JP7022886B2 (ja) * | 2017-08-21 | 2022-02-21 | パナソニックIpマネジメント株式会社 | 作業装置及び作業装置の検査方法 |
CN111788882B (zh) * | 2018-02-27 | 2021-11-09 | 松下知识产权经营株式会社 | 管理装置、管理方法以及部件安装系统 |
-
2021
- 2021-10-08 WO PCT/JP2021/037480 patent/WO2022130751A1/ja active Application Filing
- 2021-10-08 JP JP2022569730A patent/JPWO2022130751A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022130751A1 (ja) | 2022-06-23 |