JPWO2022123773A1 - - Google Patents

Info

Publication number
JPWO2022123773A1
JPWO2022123773A1 JP2022568013A JP2022568013A JPWO2022123773A1 JP WO2022123773 A1 JPWO2022123773 A1 JP WO2022123773A1 JP 2022568013 A JP2022568013 A JP 2022568013A JP 2022568013 A JP2022568013 A JP 2022568013A JP WO2022123773 A1 JPWO2022123773 A1 JP WO2022123773A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022568013A
Other languages
Japanese (ja)
Other versions
JP7493059B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022123773A1 publication Critical patent/JPWO2022123773A1/ja
Application granted granted Critical
Publication of JP7493059B2 publication Critical patent/JP7493059B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022568013A 2020-12-11 2020-12-11 部品装着機 Active JP7493059B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/046306 WO2022123773A1 (ja) 2020-12-11 2020-12-11 吸着ノズルおよび部品装着機

Publications (2)

Publication Number Publication Date
JPWO2022123773A1 true JPWO2022123773A1 (zh) 2022-06-16
JP7493059B2 JP7493059B2 (ja) 2024-05-30

Family

ID=81974277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022568013A Active JP7493059B2 (ja) 2020-12-11 2020-12-11 部品装着機

Country Status (4)

Country Link
JP (1) JP7493059B2 (zh)
CN (1) CN116615965A (zh)
DE (1) DE112020007833T5 (zh)
WO (1) WO2022123773A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024089747A1 (ja) * 2022-10-24 2024-05-02 株式会社Fuji 装着機

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
JP3793969B2 (ja) 2002-12-17 2006-07-05 千住金属工業株式会社 カラム整列装置
JP4997124B2 (ja) 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
WO2016084126A1 (ja) * 2014-11-25 2016-06-02 富士機械製造株式会社 電子部品装着機
WO2017002640A1 (ja) * 2015-07-02 2017-01-05 株式会社村田製作所 電子部品収納トレイ、複数電子部品収納体、および電子部品取り扱い方法
CN109076727B (zh) * 2016-04-13 2021-03-26 株式会社富士 安装装置及安装方法

Also Published As

Publication number Publication date
JP7493059B2 (ja) 2024-05-30
WO2022123773A1 (ja) 2022-06-16
CN116615965A (zh) 2023-08-18
DE112020007833T5 (de) 2023-09-21

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