JPWO2022118794A1 - - Google Patents

Info

Publication number
JPWO2022118794A1
JPWO2022118794A1 JP2022566904A JP2022566904A JPWO2022118794A1 JP WO2022118794 A1 JPWO2022118794 A1 JP WO2022118794A1 JP 2022566904 A JP2022566904 A JP 2022566904A JP 2022566904 A JP2022566904 A JP 2022566904A JP WO2022118794 A1 JPWO2022118794 A1 JP WO2022118794A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022566904A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022118794A1 publication Critical patent/JPWO2022118794A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Liquid Crystal (AREA)
JP2022566904A 2020-12-03 2021-11-29 Pending JPWO2022118794A1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020201128 2020-12-03
JP2021092209 2021-06-01
PCT/JP2021/043646 WO2022118794A1 (ja) 2020-12-03 2021-11-29 ポリアミド酸およびそれを含むワニス、ポリアミド酸の製造方法、ポリイミドおよびそれを含むフィルム、ならびにディスプレイパネル基板

Publications (1)

Publication Number Publication Date
JPWO2022118794A1 true JPWO2022118794A1 (ko) 2022-06-09

Family

ID=81853896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022566904A Pending JPWO2022118794A1 (ko) 2020-12-03 2021-11-29

Country Status (3)

Country Link
JP (1) JPWO2022118794A1 (ko)
TW (1) TW202231726A (ko)
WO (1) WO2022118794A1 (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014172978A (ja) * 2013-03-08 2014-09-22 Sumitomo Bakelite Co Ltd 共重合ポリイミド前駆体および共重合ポリイミド
CN111902457B (zh) * 2018-03-28 2023-03-28 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜
CN111971327B (zh) * 2018-03-30 2023-03-21 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体、柔性装置及其制造方法
CN112004858B (zh) * 2018-03-30 2023-06-30 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体及柔性装置、以及聚酰亚胺膜的制造方法
TW201943798A (zh) * 2018-04-06 2019-11-16 美商杜邦股份有限公司 供使用於電子裝置之聚合物
CN110330644A (zh) * 2019-06-14 2019-10-15 广州奥松电子有限公司 一种感湿材料及其制备方法与应用

Also Published As

Publication number Publication date
WO2022118794A1 (ja) 2022-06-09
TW202231726A (zh) 2022-08-16

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