JPWO2022113963A1 - - Google Patents

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Publication number
JPWO2022113963A1
JPWO2022113963A1 JP2022565346A JP2022565346A JPWO2022113963A1 JP WO2022113963 A1 JPWO2022113963 A1 JP WO2022113963A1 JP 2022565346 A JP2022565346 A JP 2022565346A JP 2022565346 A JP2022565346 A JP 2022565346A JP WO2022113963 A1 JPWO2022113963 A1 JP WO2022113963A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022565346A
Other languages
Japanese (ja)
Other versions
JP7776440B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022113963A1 publication Critical patent/JPWO2022113963A1/ja
Application granted granted Critical
Publication of JP7776440B2 publication Critical patent/JP7776440B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/55Liquid crystals

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2022565346A 2020-11-24 2021-11-24 ポリマーフィルム、及び、積層体 Active JP7776440B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020194651 2020-11-24
JP2020194651 2020-11-24
JP2021188869 2021-11-19
JP2021188869 2021-11-19
PCT/JP2021/042879 WO2022113963A1 (ja) 2020-11-24 2021-11-24 ポリマーフィルム、及び、積層体

Publications (2)

Publication Number Publication Date
JPWO2022113963A1 true JPWO2022113963A1 (https=) 2022-06-02
JP7776440B2 JP7776440B2 (ja) 2025-11-26

Family

ID=81754641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565346A Active JP7776440B2 (ja) 2020-11-24 2021-11-24 ポリマーフィルム、及び、積層体

Country Status (3)

Country Link
US (1) US12409632B2 (https=)
JP (1) JP7776440B2 (https=)
WO (1) WO2022113963A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023162659A1 (https=) * 2022-02-28 2023-08-31

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08323923A (ja) * 1995-03-31 1996-12-10 Sumitomo Chem Co Ltd 液晶ポリエステル樹脂組成物フィルムと金属箔との積層体およびそれを使用するプリント配線用基板
JPH10258491A (ja) * 1997-03-19 1998-09-29 Sumitomo Chem Co Ltd 積層体、積層体の製造方法および多層基板
JPH10329270A (ja) * 1997-05-29 1998-12-15 Sumitomo Chem Co Ltd 積層材料及び該材料から形成されるプリント配線用基板
JP2002064030A (ja) * 2000-08-18 2002-02-28 Sumitomo Chem Co Ltd フィルムコンデンサー
JP2007098692A (ja) * 2005-09-30 2007-04-19 Nippon Pillar Packing Co Ltd 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法
JP2016117281A (ja) * 2014-12-18 2016-06-30 住友化学株式会社 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板
JP2019065061A (ja) * 2017-09-28 2019-04-25 Agc株式会社 プリント基板用樹脂組成物および製造方法
WO2019181856A1 (ja) * 2018-03-20 2019-09-26 住友化学株式会社 液晶性ポリエステル液状組成物、液晶性ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
WO2020059651A1 (ja) * 2018-09-20 2020-03-26 東レ株式会社 熱可塑性ポリエステル樹脂組成物および成形品
WO2020218405A1 (ja) * 2019-04-26 2020-10-29 株式会社カネカ 低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板
JP2021030631A (ja) * 2019-08-27 2021-03-01 共同技研化学株式会社 積層フィルム及び該積層フィルムの製造方法
WO2022045157A1 (ja) * 2020-08-27 2022-03-03 信越ポリマー株式会社 接着剤組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69632222T2 (de) 1995-03-31 2004-08-26 Sumitomo Chemical Co., Ltd. Verbundstoff aus flüssigkristallinem Polyesterharzzusammensetzungsfilm und Metallfolie und Leiterplatte daraus
TW492996B (en) 1997-03-19 2002-07-01 Sumitomo Chemical Co Laminate of liquid crystal polyester resin composition
JP4802503B2 (ja) * 2005-01-21 2011-10-26 マツダ株式会社 操作部材用熱可塑性エラストマー組成物及びその成形部材
JP5972486B1 (ja) * 2014-09-05 2016-08-17 古河電気工業株式会社 銅箔、銅張積層板、および基板
EP3683050A4 (en) 2017-09-15 2021-06-23 JSR Corporation HIGH FREQUENCY CIRCUIT LAMINATE, MANUFACTURING METHOD FOR IT AND B-STAGE FILM
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Jx金属株式会社 表面処理銅箔及び銅張積層板
JP6619487B1 (ja) 2018-08-10 2019-12-11 住友化学株式会社 液晶ポリエステルフィルム、液晶ポリエステル液状組成物及び液晶ポリエステルフィルムの製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08323923A (ja) * 1995-03-31 1996-12-10 Sumitomo Chem Co Ltd 液晶ポリエステル樹脂組成物フィルムと金属箔との積層体およびそれを使用するプリント配線用基板
JPH10258491A (ja) * 1997-03-19 1998-09-29 Sumitomo Chem Co Ltd 積層体、積層体の製造方法および多層基板
JPH10329270A (ja) * 1997-05-29 1998-12-15 Sumitomo Chem Co Ltd 積層材料及び該材料から形成されるプリント配線用基板
JP2002064030A (ja) * 2000-08-18 2002-02-28 Sumitomo Chem Co Ltd フィルムコンデンサー
JP2007098692A (ja) * 2005-09-30 2007-04-19 Nippon Pillar Packing Co Ltd 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法
JP2016117281A (ja) * 2014-12-18 2016-06-30 住友化学株式会社 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板
JP2019065061A (ja) * 2017-09-28 2019-04-25 Agc株式会社 プリント基板用樹脂組成物および製造方法
WO2019181856A1 (ja) * 2018-03-20 2019-09-26 住友化学株式会社 液晶性ポリエステル液状組成物、液晶性ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
WO2020059651A1 (ja) * 2018-09-20 2020-03-26 東レ株式会社 熱可塑性ポリエステル樹脂組成物および成形品
WO2020218405A1 (ja) * 2019-04-26 2020-10-29 株式会社カネカ 低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板
JP2021030631A (ja) * 2019-08-27 2021-03-01 共同技研化学株式会社 積層フィルム及び該積層フィルムの製造方法
WO2022045157A1 (ja) * 2020-08-27 2022-03-03 信越ポリマー株式会社 接着剤組成物

Also Published As

Publication number Publication date
WO2022113963A1 (ja) 2022-06-02
US12409632B2 (en) 2025-09-09
US20230278317A1 (en) 2023-09-07
JP7776440B2 (ja) 2025-11-26

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