JPWO2022107286A1 - - Google Patents
Info
- Publication number
- JPWO2022107286A1 JPWO2022107286A1 JP2022563504A JP2022563504A JPWO2022107286A1 JP WO2022107286 A1 JPWO2022107286 A1 JP WO2022107286A1 JP 2022563504 A JP2022563504 A JP 2022563504A JP 2022563504 A JP2022563504 A JP 2022563504A JP WO2022107286 A1 JPWO2022107286 A1 JP WO2022107286A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/043242 WO2022107286A1 (ja) | 2020-11-19 | 2020-11-19 | 画像処理装置、実装装置、実装システム、画像処理方法及び実装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022107286A1 true JPWO2022107286A1 (ja) | 2022-05-27 |
Family
ID=81708549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022563504A Pending JPWO2022107286A1 (ja) | 2020-11-19 | 2020-11-19 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240015943A1 (ja) |
EP (1) | EP4250892A4 (ja) |
JP (1) | JPWO2022107286A1 (ja) |
CN (1) | CN116349420A (ja) |
WO (1) | WO2022107286A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09204454A (ja) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Ind Co Ltd | 部品電子カタログ |
BE1011535A3 (nl) * | 1997-11-05 | 1999-10-05 | Framatome Connectors Belgium | Werkwijze en inrichting voor het opmeten van de positie van een reeks contactpennen en voor het aanbrengen van deze reeks in een plaat met gedrukte schakelingen. |
JP4576062B2 (ja) * | 2001-03-21 | 2010-11-04 | 富士機械製造株式会社 | リード位置検出方法,電気部品装着方法およびリード位置検出装置 |
JP4623657B2 (ja) * | 2003-05-28 | 2011-02-02 | 富士機械製造株式会社 | 電子部品実装機の撮像画像処理装置及び撮像画像処理方法 |
JP4351488B2 (ja) | 2003-07-30 | 2009-10-28 | Juki株式会社 | 電子部品実装装置 |
JP5534919B2 (ja) * | 2010-04-22 | 2014-07-02 | 富士機械製造株式会社 | 電子部品の撮像判定方法及び部品実装機 |
JP6075910B2 (ja) * | 2012-07-25 | 2017-02-08 | Juki株式会社 | 情報管理システムおよび情報提供方法 |
CN105684568B (zh) * | 2013-11-13 | 2018-09-07 | 雅马哈发动机株式会社 | 元件摄像装置及采用了该元件摄像装置的表面安装机 |
JP6120922B2 (ja) * | 2015-08-04 | 2017-04-26 | 富士電機株式会社 | 部品実装装置 |
JP6764997B2 (ja) * | 2017-03-24 | 2020-10-07 | 株式会社Fuji | データ作成装置及びデータ作成方法 |
-
2020
- 2020-11-19 CN CN202080106647.6A patent/CN116349420A/zh active Pending
- 2020-11-19 WO PCT/JP2020/043242 patent/WO2022107286A1/ja active Application Filing
- 2020-11-19 JP JP2022563504A patent/JPWO2022107286A1/ja active Pending
- 2020-11-19 EP EP20962449.3A patent/EP4250892A4/en active Pending
- 2020-11-19 US US18/252,220 patent/US20240015943A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN116349420A (zh) | 2023-06-27 |
WO2022107286A1 (ja) | 2022-05-27 |
US20240015943A1 (en) | 2024-01-11 |
EP4250892A1 (en) | 2023-09-27 |
EP4250892A4 (en) | 2024-01-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231002 |