JPWO2022102489A1 - - Google Patents

Info

Publication number
JPWO2022102489A1
JPWO2022102489A1 JP2022544339A JP2022544339A JPWO2022102489A1 JP WO2022102489 A1 JPWO2022102489 A1 JP WO2022102489A1 JP 2022544339 A JP2022544339 A JP 2022544339A JP 2022544339 A JP2022544339 A JP 2022544339A JP WO2022102489 A1 JPWO2022102489 A1 JP WO2022102489A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022544339A
Other versions
JP7205673B2 (ja
JPWO2022102489A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022102489A1 publication Critical patent/JPWO2022102489A1/ja
Publication of JPWO2022102489A5 publication Critical patent/JPWO2022102489A5/ja
Application granted granted Critical
Publication of JP7205673B2 publication Critical patent/JP7205673B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022544339A 2020-11-16 2021-11-04 樹脂組成物、硬化物、半導体封止材、及び、半導体装置 Active JP7205673B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020190382 2020-11-16
JP2020190382 2020-11-16
PCT/JP2021/040509 WO2022102489A1 (ja) 2020-11-16 2021-11-04 樹脂組成物、硬化物、半導体封止材、及び、半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022102489A1 true JPWO2022102489A1 (ja) 2022-05-19
JPWO2022102489A5 JPWO2022102489A5 (ja) 2022-10-24
JP7205673B2 JP7205673B2 (ja) 2023-01-17

Family

ID=81601242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022544339A Active JP7205673B2 (ja) 2020-11-16 2021-11-04 樹脂組成物、硬化物、半導体封止材、及び、半導体装置

Country Status (3)

Country Link
JP (1) JP7205673B2 (ja)
TW (1) TW202225229A (ja)
WO (1) WO2022102489A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07196767A (ja) * 1993-12-28 1995-08-01 Nippon Kayaku Co Ltd エポキシ樹脂組成物およびその硬化物
JPH11199648A (ja) * 1998-01-19 1999-07-27 Dainippon Ink & Chem Inc エポキシ樹脂組成物
WO2005019299A1 (ja) * 2003-08-21 2005-03-03 Asahi Kasei Chemicals Corporation 感光性組成物およびその硬化物
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
US20140228483A1 (en) * 2013-02-13 2014-08-14 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
WO2015152037A1 (ja) * 2014-03-31 2015-10-08 明和化成株式会社 フェノール樹脂、該フェノール樹脂を含むエポキシ樹脂組成物、該エポキシ樹脂組成物の硬化物、及び該硬化物を有する半導体装置
WO2018003513A1 (ja) * 2016-06-29 2018-01-04 Dic株式会社 フェノールノボラック樹脂、硬化性樹脂組成物及びその硬化物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07196767A (ja) * 1993-12-28 1995-08-01 Nippon Kayaku Co Ltd エポキシ樹脂組成物およびその硬化物
JPH11199648A (ja) * 1998-01-19 1999-07-27 Dainippon Ink & Chem Inc エポキシ樹脂組成物
WO2005019299A1 (ja) * 2003-08-21 2005-03-03 Asahi Kasei Chemicals Corporation 感光性組成物およびその硬化物
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
US20140228483A1 (en) * 2013-02-13 2014-08-14 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
WO2015152037A1 (ja) * 2014-03-31 2015-10-08 明和化成株式会社 フェノール樹脂、該フェノール樹脂を含むエポキシ樹脂組成物、該エポキシ樹脂組成物の硬化物、及び該硬化物を有する半導体装置
WO2018003513A1 (ja) * 2016-06-29 2018-01-04 Dic株式会社 フェノールノボラック樹脂、硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP7205673B2 (ja) 2023-01-17
WO2022102489A1 (ja) 2022-05-19
TW202225229A (zh) 2022-07-01

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112021014123A2 (ja)
BR112022024743A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR102021007058A2 (ja)
JPWO2023032860A1 (ja)
JPWO2023286728A1 (ja)
BR112023004146A2 (ja)
BR112023011539A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)
BR102021016200A2 (ja)
BR102021015566A2 (ja)
BR102021015450A8 (ja)
BR102021015220A2 (ja)
BR102021015247A2 (ja)
BR102021014044A2 (ja)
BR102021014056A2 (ja)
BR102021013929A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220721

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220721

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220721

AA64 Notification of invalidation of claim of internal priority (with term)

Free format text: JAPANESE INTERMEDIATE CODE: A241764

Effective date: 20220802

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220825

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221011

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221110

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221129

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221212

R151 Written notification of patent or utility model registration

Ref document number: 7205673

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151