JPWO2022097483A1 - - Google Patents

Info

Publication number
JPWO2022097483A1
JPWO2022097483A1 JP2022533169A JP2022533169A JPWO2022097483A1 JP WO2022097483 A1 JPWO2022097483 A1 JP WO2022097483A1 JP 2022533169 A JP2022533169 A JP 2022533169A JP 2022533169 A JP2022533169 A JP 2022533169A JP WO2022097483 A1 JPWO2022097483 A1 JP WO2022097483A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533169A
Other languages
Japanese (ja)
Other versions
JP7260065B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097483A1 publication Critical patent/JPWO2022097483A1/ja
Application granted granted Critical
Publication of JP7260065B2 publication Critical patent/JP7260065B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2022533169A 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板 Active JP7260065B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020184976 2020-11-05
JP2020184976 2020-11-05
PCT/JP2021/038871 WO2022097483A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2022097483A1 true JPWO2022097483A1 (de) 2022-05-12
JP7260065B2 JP7260065B2 (ja) 2023-04-18

Family

ID=81457262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533169A Active JP7260065B2 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Country Status (5)

Country Link
JP (1) JP7260065B2 (de)
KR (1) KR20230098582A (de)
CN (1) CN116420433A (de)
TW (1) TW202234963A (de)
WO (1) WO2022097483A1 (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101398A (ja) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd 銀系被覆層付銅箔及びその銀系被覆層付銅箔を用いた銅張積層板
JP2010021163A (ja) * 2006-11-02 2010-01-28 Alps Electric Co Ltd 貫通電極回路基板およびその形成方法
WO2020003880A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板用積層体及びそれを用いたプリント配線板
WO2020003878A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板の製造方法
WO2020003877A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板の製造方法
WO2020003881A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425030D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
JP3570802B2 (ja) 1995-11-14 2004-09-29 三井化学株式会社 銅薄膜基板及びプリント配線板
JP2007122952A (ja) * 2005-10-26 2007-05-17 Auto Network Gijutsu Kenkyusho:Kk プレスフィット端子と基板の接続構造
WO2009004774A1 (ja) 2007-07-02 2009-01-08 Panasonic Corporation 金属積層ポリイミド基盤及びその製造方法
JP2010272837A (ja) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd プリント配線板用基板、プリント配線板、及びプリント配線板用基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101398A (ja) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd 銀系被覆層付銅箔及びその銀系被覆層付銅箔を用いた銅張積層板
JP2010021163A (ja) * 2006-11-02 2010-01-28 Alps Electric Co Ltd 貫通電極回路基板およびその形成方法
WO2020003880A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板用積層体及びそれを用いたプリント配線板
WO2020003878A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板の製造方法
WO2020003877A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板の製造方法
WO2020003881A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Also Published As

Publication number Publication date
CN116420433A (zh) 2023-07-11
TW202234963A (zh) 2022-09-01
KR20230098582A (ko) 2023-07-04
JP7260065B2 (ja) 2023-04-18
WO2022097483A1 (ja) 2022-05-12

Similar Documents

Publication Publication Date Title
BR112023005462A2 (de)
BR112023012656A2 (de)
BR112021014123A2 (de)
BR112022009896A2 (de)
BR112023009656A2 (de)
BR112022024743A2 (de)
BR112023006729A2 (de)
BR102021018859A2 (de)
BR102021015500A2 (de)
BR112023008622A2 (de)
BR112023011738A2 (de)
BR112023016292A2 (de)
BR112023004146A2 (de)
BR112023011610A2 (de)
BR112023011539A2 (de)
BR112023008976A2 (de)
JPWO2022097483A1 (de)
BR102021020147A2 (de)
BR102021018926A2 (de)
BR102021018167A2 (de)
BR102021017576A2 (de)
BR102021016837A2 (de)
BR102021016551A2 (de)
BR102021016375A2 (de)
BR102021016176A2 (de)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220602

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220602

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220809

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220818

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221215

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230307

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230320

R151 Written notification of patent or utility model registration

Ref document number: 7260065

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151