JPWO2022097481A1 - - Google Patents

Info

Publication number
JPWO2022097481A1
JPWO2022097481A1 JP2022527760A JP2022527760A JPWO2022097481A1 JP WO2022097481 A1 JPWO2022097481 A1 JP WO2022097481A1 JP 2022527760 A JP2022527760 A JP 2022527760A JP 2022527760 A JP2022527760 A JP 2022527760A JP WO2022097481 A1 JPWO2022097481 A1 JP WO2022097481A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022527760A
Other languages
Japanese (ja)
Other versions
JPWO2022097481A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097481A1 publication Critical patent/JPWO2022097481A1/ja
Publication of JPWO2022097481A5 publication Critical patent/JPWO2022097481A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP2022527760A 2020-11-05 2021-10-21 Pending JPWO2022097481A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184974 2020-11-05
PCT/JP2021/038869 WO2022097481A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2022097481A1 true JPWO2022097481A1 (enrdf_load_stackoverflow) 2022-05-12
JPWO2022097481A5 JPWO2022097481A5 (enrdf_load_stackoverflow) 2022-10-17

Family

ID=81457260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527760A Pending JPWO2022097481A1 (enrdf_load_stackoverflow) 2020-11-05 2021-10-21

Country Status (3)

Country Link
JP (1) JPWO2022097481A1 (enrdf_load_stackoverflow)
TW (1) TW202233414A (enrdf_load_stackoverflow)
WO (1) WO2022097481A1 (enrdf_load_stackoverflow)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067341A (ja) * 2005-09-02 2007-03-15 Nippon Mektron Ltd 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
WO2019217388A1 (en) * 2018-05-08 2019-11-14 Macdermid Enthone Inc. Carbon-based direct plating process
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067341A (ja) * 2005-09-02 2007-03-15 Nippon Mektron Ltd 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
WO2019217388A1 (en) * 2018-05-08 2019-11-14 Macdermid Enthone Inc. Carbon-based direct plating process
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Also Published As

Publication number Publication date
TW202233414A (zh) 2022-09-01
WO2022097481A1 (ja) 2022-05-12

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