TW202233414A - 印刷配線板之製造方法 - Google Patents

印刷配線板之製造方法 Download PDF

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Publication number
TW202233414A
TW202233414A TW110140952A TW110140952A TW202233414A TW 202233414 A TW202233414 A TW 202233414A TW 110140952 A TW110140952 A TW 110140952A TW 110140952 A TW110140952 A TW 110140952A TW 202233414 A TW202233414 A TW 202233414A
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TW
Taiwan
Prior art keywords
group
layer
mentioned
resin
silver particle
Prior art date
Application number
TW110140952A
Other languages
English (en)
Chinese (zh)
Inventor
深澤憲正
村川昭
白髪潤
Original Assignee
日商Dic股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Dic股份有限公司 filed Critical 日商Dic股份有限公司
Publication of TW202233414A publication Critical patent/TW202233414A/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
TW110140952A 2020-11-05 2021-11-03 印刷配線板之製造方法 TW202233414A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184974 2020-11-05
JPJP2020-184974 2020-11-05

Publications (1)

Publication Number Publication Date
TW202233414A true TW202233414A (zh) 2022-09-01

Family

ID=81457260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140952A TW202233414A (zh) 2020-11-05 2021-11-03 印刷配線板之製造方法

Country Status (3)

Country Link
JP (1) JPWO2022097481A1 (enrdf_load_stackoverflow)
TW (1) TW202233414A (enrdf_load_stackoverflow)
WO (1) WO2022097481A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624217B2 (ja) * 2005-09-02 2011-02-02 日本メクトロン株式会社 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
EP3817526A4 (en) * 2018-06-26 2022-04-06 DIC Corporation PROCESS FOR MAKING A METAL PATTERN MOLDING

Also Published As

Publication number Publication date
WO2022097481A1 (ja) 2022-05-12
JPWO2022097481A1 (enrdf_load_stackoverflow) 2022-05-12

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