JPWO2022097484A1 - - Google Patents

Info

Publication number
JPWO2022097484A1
JPWO2022097484A1 JP2022533166A JP2022533166A JPWO2022097484A1 JP WO2022097484 A1 JPWO2022097484 A1 JP WO2022097484A1 JP 2022533166 A JP2022533166 A JP 2022533166A JP 2022533166 A JP2022533166 A JP 2022533166A JP WO2022097484 A1 JPWO2022097484 A1 JP WO2022097484A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022533166A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097484A1 publication Critical patent/JPWO2022097484A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2022533166A 2020-11-05 2021-10-21 Pending JPWO2022097484A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184977 2020-11-05
PCT/JP2021/038872 WO2022097484A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (1)

Publication Number Publication Date
JPWO2022097484A1 true JPWO2022097484A1 (enrdf_load_stackoverflow) 2022-05-12

Family

ID=81457868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533166A Pending JPWO2022097484A1 (enrdf_load_stackoverflow) 2020-11-05 2021-10-21

Country Status (3)

Country Link
JP (1) JPWO2022097484A1 (enrdf_load_stackoverflow)
TW (1) TW202234959A (enrdf_load_stackoverflow)
WO (1) WO2022097484A1 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332735A (ja) * 2002-05-14 2003-11-21 Fujitsu Ltd 配線基板およびその製造方法ならびに導体張板
JP2013222908A (ja) * 2012-04-19 2013-10-28 Achilles Corp 両面回路基板の製造方法、および両面回路基板
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法
WO2020003880A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板用積層体及びそれを用いたプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332735A (ja) * 2002-05-14 2003-11-21 Fujitsu Ltd 配線基板およびその製造方法ならびに導体張板
JP2013222908A (ja) * 2012-04-19 2013-10-28 Achilles Corp 両面回路基板の製造方法、および両面回路基板
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法
WO2020003880A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 プリント配線板用積層体及びそれを用いたプリント配線板

Also Published As

Publication number Publication date
TW202234959A (zh) 2022-09-01
WO2022097484A1 (ja) 2022-05-12

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