JPWO2022097480A1 - - Google Patents

Info

Publication number
JPWO2022097480A1
JPWO2022097480A1 JP2022527759A JP2022527759A JPWO2022097480A1 JP WO2022097480 A1 JPWO2022097480 A1 JP WO2022097480A1 JP 2022527759 A JP2022527759 A JP 2022527759A JP 2022527759 A JP2022527759 A JP 2022527759A JP WO2022097480 A1 JPWO2022097480 A1 JP WO2022097480A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022527759A
Other languages
Japanese (ja)
Other versions
JP7288230B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097480A1 publication Critical patent/JPWO2022097480A1/ja
Application granted granted Critical
Publication of JP7288230B2 publication Critical patent/JP7288230B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP2022527759A 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板 Active JP7288230B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020184973 2020-11-05
JP2020184973 2020-11-05
PCT/JP2021/038868 WO2022097480A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2022097480A1 true JPWO2022097480A1 (de) 2022-05-12
JP7288230B2 JP7288230B2 (ja) 2023-06-07

Family

ID=81457247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527759A Active JP7288230B2 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Country Status (5)

Country Link
JP (1) JP7288230B2 (de)
KR (1) KR20230098195A (de)
CN (1) CN116508400A (de)
TW (1) TW202236926A (de)
WO (1) WO2022097480A1 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332735A (ja) * 2002-05-14 2003-11-21 Fujitsu Ltd 配線基板およびその製造方法ならびに導体張板
JP2009239238A (ja) * 2008-03-28 2009-10-15 Fujifilm Corp 電子回路基板の製造方法
JP2013222908A (ja) * 2012-04-19 2013-10-28 Achilles Corp 両面回路基板の製造方法、および両面回路基板
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3570802B2 (ja) 1995-11-14 2004-09-29 三井化学株式会社 銅薄膜基板及びプリント配線板
US10021789B2 (en) 2007-07-02 2018-07-10 Ebara-Udylite Co., Ltd. Metal-laminated polyimide substrate, and method for production thereof
JP2010272837A (ja) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd プリント配線板用基板、プリント配線板、及びプリント配線板用基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332735A (ja) * 2002-05-14 2003-11-21 Fujitsu Ltd 配線基板およびその製造方法ならびに導体張板
JP2009239238A (ja) * 2008-03-28 2009-10-15 Fujifilm Corp 電子回路基板の製造方法
JP2013222908A (ja) * 2012-04-19 2013-10-28 Achilles Corp 両面回路基板の製造方法、および両面回路基板
WO2020003879A1 (ja) * 2018-06-26 2020-01-02 Dic株式会社 金属パターンを有する成形体の製造方法

Also Published As

Publication number Publication date
KR20230098195A (ko) 2023-07-03
TW202236926A (zh) 2022-09-16
JP7288230B2 (ja) 2023-06-07
WO2022097480A1 (ja) 2022-05-12
CN116508400A (zh) 2023-07-28

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