JPWO2022085532A1 - - Google Patents
Info
- Publication number
- JPWO2022085532A1 JPWO2022085532A1 JP2022557039A JP2022557039A JPWO2022085532A1 JP WO2022085532 A1 JPWO2022085532 A1 JP WO2022085532A1 JP 2022557039 A JP2022557039 A JP 2022557039A JP 2022557039 A JP2022557039 A JP 2022557039A JP WO2022085532 A1 JPWO2022085532 A1 JP WO2022085532A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020176906 | 2020-10-21 | ||
| PCT/JP2021/037872 WO2022085532A1 (ja) | 2020-10-21 | 2021-10-13 | 封止用樹脂組成物、及び電子デバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022085532A1 true JPWO2022085532A1 (ja) | 2022-04-28 |
Family
ID=81290763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022557039A Pending JPWO2022085532A1 (ja) | 2020-10-21 | 2021-10-13 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022085532A1 (ja) |
| CN (1) | CN116349009A (ja) |
| TW (1) | TW202225248A (ja) |
| WO (1) | WO2022085532A1 (ja) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718118A (ja) * | 1993-06-30 | 1995-01-20 | Matsushita Electric Works Ltd | 熱硬化性液状樹脂組成物 |
| JP5555990B2 (ja) * | 2008-08-22 | 2014-07-23 | 住友ベークライト株式会社 | 樹脂組成物、および樹脂組成物を用いて作製した半導体装置 |
| JP6175515B2 (ja) * | 2013-01-23 | 2017-08-02 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | アンダーフィル組成物およびそれを使用したパッケージング工程 |
| JP6904125B2 (ja) * | 2017-07-18 | 2021-07-14 | 味の素株式会社 | 樹脂組成物 |
| JP2020147643A (ja) * | 2019-03-12 | 2020-09-17 | 日本化薬株式会社 | 樹脂組成物及び電子部品用接着剤 |
| JP7298383B2 (ja) * | 2019-08-09 | 2023-06-27 | 味の素株式会社 | 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 |
-
2021
- 2021-10-13 CN CN202180070218.2A patent/CN116349009A/zh active Pending
- 2021-10-13 JP JP2022557039A patent/JPWO2022085532A1/ja active Pending
- 2021-10-13 WO PCT/JP2021/037872 patent/WO2022085532A1/ja active Application Filing
- 2021-10-18 TW TW110138573A patent/TW202225248A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202225248A (zh) | 2022-07-01 |
| WO2022085532A1 (ja) | 2022-04-28 |
| CN116349009A (zh) | 2023-06-27 |