JPWO2022084800A1 - - Google Patents

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Publication number
JPWO2022084800A1
JPWO2022084800A1 JP2022557216A JP2022557216A JPWO2022084800A1 JP WO2022084800 A1 JPWO2022084800 A1 JP WO2022084800A1 JP 2022557216 A JP2022557216 A JP 2022557216A JP 2022557216 A JP2022557216 A JP 2022557216A JP WO2022084800 A1 JPWO2022084800 A1 JP WO2022084800A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022557216A
Other languages
Japanese (ja)
Other versions
JPWO2022084800A5 (https=
JP7723677B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022084800A1 publication Critical patent/JPWO2022084800A1/ja
Publication of JPWO2022084800A5 publication Critical patent/JPWO2022084800A5/ja
Priority to JP2025129098A priority Critical patent/JP7854098B2/ja
Application granted granted Critical
Publication of JP7723677B2 publication Critical patent/JP7723677B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B53/00Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/30Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/221Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements using ferroelectric capacitors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/225Auxiliary circuits
    • G11C11/2259Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/225Auxiliary circuits
    • G11C11/2273Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/225Auxiliary circuits
    • G11C11/2275Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B53/00Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/40Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the peripheral circuit region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Thin Film Transistor (AREA)
  • Memory System (AREA)
JP2022557216A 2020-10-20 2021-10-12 半導体装置、及び電子機器 Active JP7723677B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025129098A JP7854098B2 (ja) 2020-10-20 2025-08-01 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020176312 2020-10-20
JP2020176312 2020-10-20
PCT/IB2021/059303 WO2022084800A1 (ja) 2020-10-20 2021-10-12 半導体装置、及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025129098A Division JP7854098B2 (ja) 2020-10-20 2025-08-01 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022084800A1 true JPWO2022084800A1 (https=) 2022-04-28
JPWO2022084800A5 JPWO2022084800A5 (https=) 2024-10-17
JP7723677B2 JP7723677B2 (ja) 2025-08-14

Family

ID=81289711

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022557216A Active JP7723677B2 (ja) 2020-10-20 2021-10-12 半導体装置、及び電子機器
JP2025129098A Active JP7854098B2 (ja) 2020-10-20 2025-08-01 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025129098A Active JP7854098B2 (ja) 2020-10-20 2025-08-01 半導体装置

Country Status (5)

Country Link
US (1) US20230337439A1 (https=)
JP (2) JP7723677B2 (https=)
KR (1) KR20230088692A (https=)
CN (1) CN116601707A (https=)
WO (1) WO2022084800A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230268355A1 (en) * 2022-02-23 2023-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit device and method for fabricating the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897386A (ja) * 1994-09-28 1996-04-12 Nec Corp 半導体不揮発性メモリセル及びその動作方法
JP2003178577A (ja) * 2001-12-11 2003-06-27 Fujitsu Ltd 強誘電体メモリ
JP2008140220A (ja) * 2006-12-04 2008-06-19 Nec Corp 半導体装置
JP2013243351A (ja) * 2012-04-27 2013-12-05 Semiconductor Energy Lab Co Ltd スタンダードセル、及び半導体集積回路

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102742003B (zh) 2010-01-15 2015-01-28 株式会社半导体能源研究所 半导体器件
EP3304554A4 (en) * 2015-05-28 2019-01-09 INTEL Corporation MEMORY CELL BASED ON FERROELECTRIC MATERIAL WITH NON-VOLATILE RETENTION
US9773787B2 (en) * 2015-11-03 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, electronic device, or method for driving the semiconductor device
WO2018073708A1 (en) * 2016-10-20 2018-04-26 Semiconductor Energy Laboratory Co., Ltd. Storage device, driving method thereof, semiconductor device, electronic component, and electronic device
US10679688B2 (en) * 2018-04-16 2020-06-09 Samsung Electronics Co., Ltd. Ferroelectric-based memory cell usable in on-logic chip memory
US11631447B2 (en) * 2019-07-25 2023-04-18 Taiwan Semiconductor Manufacturing Co., Ltd. Memory circuit and manufacturing method thereof
TWI865775B (zh) * 2020-05-15 2024-12-11 日商半導體能源研究所股份有限公司 半導體裝置及電子裝置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897386A (ja) * 1994-09-28 1996-04-12 Nec Corp 半導体不揮発性メモリセル及びその動作方法
JP2003178577A (ja) * 2001-12-11 2003-06-27 Fujitsu Ltd 強誘電体メモリ
JP2008140220A (ja) * 2006-12-04 2008-06-19 Nec Corp 半導体装置
JP2013243351A (ja) * 2012-04-27 2013-12-05 Semiconductor Energy Lab Co Ltd スタンダードセル、及び半導体集積回路

Also Published As

Publication number Publication date
JP7854098B2 (ja) 2026-04-30
JP7723677B2 (ja) 2025-08-14
CN116601707A (zh) 2023-08-15
JP2025156480A (ja) 2025-10-14
KR20230088692A (ko) 2023-06-20
US20230337439A1 (en) 2023-10-19
WO2022084800A1 (ja) 2022-04-28

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