JPWO2022075221A1 - - Google Patents

Info

Publication number
JPWO2022075221A1
JPWO2022075221A1 JP2022555443A JP2022555443A JPWO2022075221A1 JP WO2022075221 A1 JPWO2022075221 A1 JP WO2022075221A1 JP 2022555443 A JP2022555443 A JP 2022555443A JP 2022555443 A JP2022555443 A JP 2022555443A JP WO2022075221 A1 JPWO2022075221 A1 JP WO2022075221A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022555443A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022075221A1 publication Critical patent/JPWO2022075221A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2022555443A 2020-10-07 2021-10-01 Pending JPWO2022075221A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020169715 2020-10-07
PCT/JP2021/036452 WO2022075221A1 (ja) 2020-10-07 2021-10-01 樹脂組成物、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
JPWO2022075221A1 true JPWO2022075221A1 (enrdf_load_stackoverflow) 2022-04-14

Family

ID=81126854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555443A Pending JPWO2022075221A1 (enrdf_load_stackoverflow) 2020-10-07 2021-10-01

Country Status (5)

Country Link
JP (1) JPWO2022075221A1 (enrdf_load_stackoverflow)
KR (1) KR20230084492A (enrdf_load_stackoverflow)
CN (1) CN116323195A (enrdf_load_stackoverflow)
TW (1) TW202227554A (enrdf_load_stackoverflow)
WO (1) WO2022075221A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250090979A (ko) * 2023-12-13 2025-06-20 주식회사 두산 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089137A (ja) * 2014-11-11 2016-05-23 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP2017075270A (ja) * 2015-10-16 2017-04-20 三菱瓦斯化学株式会社 プリプレグ
WO2019172342A1 (ja) * 2018-03-06 2019-09-12 日立化成株式会社 プリプレグ、積層板、多層プリント配線板、半導体パッケージ及び樹脂組成物、並びに、プリプレグ、積層板及び多層プリント配線板の製造方法
CN111471144A (zh) * 2020-03-27 2020-07-31 顺德职业技术学院 丙烯酸改性低介电含氟聚苯醚混合胶及其制备的5g覆铜板
JP2021138944A (ja) * 2020-02-28 2021-09-16 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッドINNOX Advanced Materials Co., Ltd. 接着フィルム、これを含む接着フィルム付き積層体、及びこれを含む金属箔積層体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869046A (ja) 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS6118937A (ja) 1984-07-06 1986-01-27 Mitsubishi Electric Corp 工業用テレビカメラの照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089137A (ja) * 2014-11-11 2016-05-23 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP2017075270A (ja) * 2015-10-16 2017-04-20 三菱瓦斯化学株式会社 プリプレグ
WO2019172342A1 (ja) * 2018-03-06 2019-09-12 日立化成株式会社 プリプレグ、積層板、多層プリント配線板、半導体パッケージ及び樹脂組成物、並びに、プリプレグ、積層板及び多層プリント配線板の製造方法
JP2021138944A (ja) * 2020-02-28 2021-09-16 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッドINNOX Advanced Materials Co., Ltd. 接着フィルム、これを含む接着フィルム付き積層体、及びこれを含む金属箔積層体
CN111471144A (zh) * 2020-03-27 2020-07-31 顺德职业技术学院 丙烯酸改性低介电含氟聚苯醚混合胶及其制备的5g覆铜板

Also Published As

Publication number Publication date
TW202227554A (zh) 2022-07-16
CN116323195A (zh) 2023-06-23
KR20230084492A (ko) 2023-06-13
WO2022075221A1 (ja) 2022-04-14

Similar Documents

Publication Publication Date Title
BR112023005462A2 (enrdf_load_stackoverflow)
BR112023012656A2 (enrdf_load_stackoverflow)
BR112021014123A2 (enrdf_load_stackoverflow)
BR112023009656A2 (enrdf_load_stackoverflow)
BR112022009896A2 (enrdf_load_stackoverflow)
BR112023008622A2 (enrdf_load_stackoverflow)
BR112022024743A2 (enrdf_load_stackoverflow)
BR112022026905A2 (enrdf_load_stackoverflow)
BR112023011738A2 (enrdf_load_stackoverflow)
BR112023004146A2 (enrdf_load_stackoverflow)
BR112023006729A2 (enrdf_load_stackoverflow)
BR102021018859A2 (enrdf_load_stackoverflow)
BR102021015500A2 (enrdf_load_stackoverflow)
BR112021017747A2 (enrdf_load_stackoverflow)
BR112023016292A2 (enrdf_load_stackoverflow)
BR112023011539A2 (enrdf_load_stackoverflow)
BR112023011610A2 (enrdf_load_stackoverflow)
BR112023008976A2 (enrdf_load_stackoverflow)
BR102021020147A2 (enrdf_load_stackoverflow)
BR102021018926A2 (enrdf_load_stackoverflow)
BR102021018167A2 (enrdf_load_stackoverflow)
BR102021017576A2 (enrdf_load_stackoverflow)
BR102021016837A2 (enrdf_load_stackoverflow)
BR102021016551A2 (enrdf_load_stackoverflow)
BR102021016375A2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240906

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250909