JPWO2022071329A1 - - Google Patents
Info
- Publication number
- JPWO2022071329A1 JPWO2022071329A1 JP2022554021A JP2022554021A JPWO2022071329A1 JP WO2022071329 A1 JPWO2022071329 A1 JP WO2022071329A1 JP 2022554021 A JP2022554021 A JP 2022554021A JP 2022554021 A JP2022554021 A JP 2022554021A JP WO2022071329 A1 JPWO2022071329 A1 JP WO2022071329A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/145—Polyamides; Polyesteramides; Polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
- C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/24—Homopolymers or copolymers of amides or imides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2020/037322 | 2020-09-30 | ||
| PCT/JP2020/037322 WO2022070362A1 (ja) | 2020-09-30 | 2020-09-30 | 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置 |
| PCT/JP2021/035672 WO2022071329A1 (ja) | 2020-09-30 | 2021-09-28 | 樹脂組成物、半導体装置の製造方法、硬化物、半導体装置及びポリイミド前駆体の合成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022071329A1 true JPWO2022071329A1 (https=) | 2022-04-07 |
| JP7853216B2 JP7853216B2 (ja) | 2026-04-28 |
Family
ID=80949128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022554021A Active JP7853216B2 (ja) | 2020-09-30 | 2021-09-28 | 樹脂組成物、半導体装置の製造方法、硬化物、半導体装置及びポリイミド前駆体の合成方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240018306A1 (https=) |
| JP (1) | JP7853216B2 (https=) |
| KR (1) | KR20230075457A (https=) |
| TW (1) | TW202229408A (https=) |
| WO (2) | WO2022070362A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023132964A (ja) * | 2022-03-11 | 2023-09-22 | Ｈｄマイクロシステムズ株式会社 | 絶縁膜形成材料、半導体装置の製造方法及び半導体装置 |
| JP2023136961A (ja) * | 2022-03-17 | 2023-09-29 | Ｈｄマイクロシステムズ株式会社 | 絶縁膜形成材料、半導体装置の製造方法及び半導体装置 |
| JP2023136962A (ja) * | 2022-03-17 | 2023-09-29 | Ｈｄマイクロシステムズ株式会社 | 絶縁膜形成材料、半導体装置の製造方法及び半導体装置 |
| CN118946610A (zh) * | 2022-03-25 | 2024-11-12 | 艾曲迪微系统股份有限公司 | 混合键合绝缘膜形成材料、半导体装置的制造方法及半导体装置 |
| WO2023228321A1 (ja) * | 2022-05-25 | 2023-11-30 | 株式会社レゾナック | 半導体装置の製造方法 |
| WO2024054799A1 (en) * | 2022-09-07 | 2024-03-14 | Adeia Semiconductor Bonding Technologies Inc. | Rapid thermal processing for direct bonding |
| TW202435271A (zh) * | 2023-01-11 | 2024-09-01 | 日商東麗股份有限公司 | 積層體的製造方法、樹脂組成物 |
| TW202435270A (zh) * | 2023-01-11 | 2024-09-01 | 日商東麗股份有限公司 | 積層體、半導體元件及mems元件 |
| CN120615235A (zh) * | 2023-02-03 | 2025-09-09 | 三井化学株式会社 | 半导体结构体及其制造方法 |
| CN120958551A (zh) * | 2023-03-31 | 2025-11-14 | 三井化学株式会社 | 组合物、基板层叠体及基板层叠体的制造方法 |
| JPWO2024219502A1 (https=) * | 2023-04-19 | 2024-10-24 | ||
| TW202514829A (zh) * | 2023-05-30 | 2025-04-01 | 日商大賽璐股份有限公司 | 聚合物及含其之感光性樹脂組成物、銅膏、液狀組成物、半導體裝置之製造方法及半導體連接用銅柱之製造方法 |
| TW202507755A (zh) * | 2023-05-30 | 2025-02-16 | 日商大賽璐股份有限公司 | 聚合物及含其之感光性樹脂組成物、銅膏、液狀組成物、半導體裝置之製造方法及半導體連接用銅柱之製造方法 |
| CN121219827A (zh) * | 2023-05-30 | 2025-12-26 | 株式会社大赛璐 | 聚合物及包含该聚合物的感光性树脂组合物、铜糊、液态组合物、半导体器件的制造方法及半导体连接用铜柱的制造方法 |
| CN121058079A (zh) * | 2023-08-10 | 2025-12-02 | 株式会社力森诺科 | 半导体装置的制造方法及半导体装置 |
| WO2025094691A1 (ja) * | 2023-10-30 | 2025-05-08 | Ｈｄマイクロシステムズ株式会社 | 絶縁膜形成材料、絶縁膜形成材料キット、半導体装置の製造方法及び半導体装置 |
| TW202540211A (zh) * | 2024-02-22 | 2025-10-16 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件、以及聚醯胺酸酯之製造方法 |
| WO2026070803A1 (ja) * | 2024-09-27 | 2026-04-02 | 富士フイルム株式会社 | 接合体の製造方法、接合体、デバイスの製造方法、及び、樹脂組成物 |
| WO2026069655A1 (ja) * | 2024-09-30 | 2026-04-02 | Ｒａｐｉｄｕｓ株式会社 | 半導体装置および半導体装置の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087229A (ja) * | 2008-09-30 | 2010-04-15 | Sanyo Electric Co Ltd | 半導体モジュール、半導体モジュールの製造方法および携帯機器 |
| JP2017219850A (ja) * | 2014-03-17 | 2017-12-14 | 旭化成株式会社 | 感光性樹脂組成物 |
| WO2018181893A1 (ja) * | 2017-03-31 | 2018-10-04 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| WO2019049517A1 (ja) * | 2017-09-07 | 2019-03-14 | 東レ株式会社 | 樹脂組成物、樹脂膜の製造方法および電子デバイスの製造方法 |
| JP2019206689A (ja) * | 2018-05-29 | 2019-12-05 | 旭化成株式会社 | 樹脂組成物、及び硬化膜の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108431135B (zh) * | 2015-12-11 | 2020-06-23 | 东丽株式会社 | 树脂组合物、树脂的制造方法、树脂膜的制造方法和电子设备的制造方法 |
| JP7238271B2 (ja) | 2018-05-21 | 2023-03-14 | 住友ベークライト株式会社 | 電子装置、及び電子装置の製造方法 |
-
2020
- 2020-09-30 WO PCT/JP2020/037322 patent/WO2022070362A1/ja not_active Ceased
-
2021
- 2021-09-28 KR KR1020237010875A patent/KR20230075457A/ko active Pending
- 2021-09-28 WO PCT/JP2021/035672 patent/WO2022071329A1/ja not_active Ceased
- 2021-09-28 US US18/029,102 patent/US20240018306A1/en active Pending
- 2021-09-28 JP JP2022554021A patent/JP7853216B2/ja active Active
- 2021-09-29 TW TW110136323A patent/TW202229408A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087229A (ja) * | 2008-09-30 | 2010-04-15 | Sanyo Electric Co Ltd | 半導体モジュール、半導体モジュールの製造方法および携帯機器 |
| JP2017219850A (ja) * | 2014-03-17 | 2017-12-14 | 旭化成株式会社 | 感光性樹脂組成物 |
| WO2018181893A1 (ja) * | 2017-03-31 | 2018-10-04 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| WO2019049517A1 (ja) * | 2017-09-07 | 2019-03-14 | 東レ株式会社 | 樹脂組成物、樹脂膜の製造方法および電子デバイスの製造方法 |
| JP2019206689A (ja) * | 2018-05-29 | 2019-12-05 | 旭化成株式会社 | 樹脂組成物、及び硬化膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022071329A1 (ja) | 2022-04-07 |
| TW202229408A (zh) | 2022-08-01 |
| KR20230075457A (ko) | 2023-05-31 |
| US20240018306A1 (en) | 2024-01-18 |
| WO2022070362A1 (ja) | 2022-04-07 |
| JP7853216B2 (ja) | 2026-04-28 |
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