JPWO2022071131A1 - - Google Patents
Info
- Publication number
- JPWO2022071131A1 JPWO2022071131A1 JP2022553905A JP2022553905A JPWO2022071131A1 JP WO2022071131 A1 JPWO2022071131 A1 JP WO2022071131A1 JP 2022553905 A JP2022553905 A JP 2022553905A JP 2022553905 A JP2022553905 A JP 2022553905A JP WO2022071131 A1 JPWO2022071131 A1 JP WO2022071131A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
- C01F7/021—After-treatment of oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Computer Hardware Design (AREA)
- Medicinal Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020163857 | 2020-09-29 | ||
PCT/JP2021/035131 WO2022071131A1 (ja) | 2020-09-29 | 2021-09-24 | 球状アルミナ粉末、樹脂組成物、半導体封止材料 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022071131A1 true JPWO2022071131A1 (zh) | 2022-04-07 |
Family
ID=80949099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022553905A Pending JPWO2022071131A1 (zh) | 2020-09-29 | 2021-09-24 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022071131A1 (zh) |
TW (1) | TW202220124A (zh) |
WO (1) | WO2022071131A1 (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5822055B2 (ja) * | 1979-06-15 | 1983-05-06 | 昭和電工株式会社 | 高分子物質用配合剤 |
JP4361997B2 (ja) * | 2000-02-17 | 2009-11-11 | 電気化学工業株式会社 | 球状アルミナ粉末及び樹脂組成物 |
JP5345340B2 (ja) * | 2008-05-16 | 2013-11-20 | 新日鉄住金マテリアルズ株式会社 | アルミナ配合粒子および樹脂成形体 |
JP5568399B2 (ja) * | 2010-07-14 | 2014-08-06 | 電気化学工業株式会社 | 球状アルミナ粉末、その製造方法及び用途 |
JP6287085B2 (ja) * | 2013-11-11 | 2018-03-07 | 住友ベークライト株式会社 | 有機化合物修飾無機フィラーの製造方法 |
JP6888870B2 (ja) * | 2017-08-30 | 2021-06-16 | 京セラ株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
-
2021
- 2021-09-24 JP JP2022553905A patent/JPWO2022071131A1/ja active Pending
- 2021-09-24 WO PCT/JP2021/035131 patent/WO2022071131A1/ja active Application Filing
- 2021-09-28 TW TW110135977A patent/TW202220124A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202220124A (zh) | 2022-05-16 |
WO2022071131A1 (ja) | 2022-04-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230608 |