JPWO2022070390A1 - - Google Patents

Info

Publication number
JPWO2022070390A1
JPWO2022070390A1 JP2021546795A JP2021546795A JPWO2022070390A1 JP WO2022070390 A1 JPWO2022070390 A1 JP WO2022070390A1 JP 2021546795 A JP2021546795 A JP 2021546795A JP 2021546795 A JP2021546795 A JP 2021546795A JP WO2022070390 A1 JPWO2022070390 A1 JP WO2022070390A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021546795A
Other versions
JP6950120B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP6950120B1 publication Critical patent/JP6950120B1/ja
Publication of JPWO2022070390A1 publication Critical patent/JPWO2022070390A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/7999—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto for disconnecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2021546795A 2020-10-01 2020-10-01 分離装置及び分離方法 Active JP6950120B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/037457 WO2022070390A1 (ja) 2020-10-01 2020-10-01 分離装置及び分離方法

Publications (2)

Publication Number Publication Date
JP6950120B1 JP6950120B1 (ja) 2021-10-13
JPWO2022070390A1 true JPWO2022070390A1 (ja) 2022-04-07

Family

ID=78001384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021546795A Active JP6950120B1 (ja) 2020-10-01 2020-10-01 分離装置及び分離方法

Country Status (5)

Country Link
JP (1) JP6950120B1 (ja)
KR (1) KR20230047950A (ja)
CN (1) CN115243863A (ja)
TW (1) TW202228988A (ja)
WO (2) WO2022070390A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7695667B2 (en) * 2006-03-01 2010-04-13 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for separating a stamper from a patterned substrate
JP4373491B1 (ja) * 2009-04-27 2009-11-25 信越エンジニアリング株式会社 貼り合わせ方法及び装置
JP2012045842A (ja) * 2010-08-27 2012-03-08 Toshiba Mach Co Ltd 転写装置および転写方法
JP2012213889A (ja) * 2011-03-31 2012-11-08 Hoya Corp インプリント装置及び離型方法
JP2012227430A (ja) * 2011-04-21 2012-11-15 Hoya Corp ナノインプリント装置及び離型方法
CN103959453B (zh) * 2011-11-25 2017-03-08 信越工程株式会社 基板输送装置及基板装配线
WO2015072572A1 (ja) 2013-11-18 2015-05-21 Ｓｃｉｖａｘ株式会社 離型装置及び離型方法

Also Published As

Publication number Publication date
WO2022070465A1 (ja) 2022-04-07
TW202228988A (zh) 2022-08-01
WO2022070390A1 (ja) 2022-04-07
JP6950120B1 (ja) 2021-10-13
KR20230047950A (ko) 2023-04-10
CN115243863A (zh) 2022-10-25

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