JPWO2022065496A1 - - Google Patents

Info

Publication number
JPWO2022065496A1
JPWO2022065496A1 JP2022552108A JP2022552108A JPWO2022065496A1 JP WO2022065496 A1 JPWO2022065496 A1 JP WO2022065496A1 JP 2022552108 A JP2022552108 A JP 2022552108A JP 2022552108 A JP2022552108 A JP 2022552108A JP WO2022065496 A1 JPWO2022065496 A1 JP WO2022065496A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022552108A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022065496A1 publication Critical patent/JPWO2022065496A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/21—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP2022552108A 2020-09-28 2021-09-27 Pending JPWO2022065496A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020161830 2020-09-28
PCT/JP2021/035445 WO2022065496A1 (ja) 2020-09-28 2021-09-27 回路接続用接着剤フィルム、無機フィラー含有組成物、並びに、回路接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022065496A1 true JPWO2022065496A1 (zh) 2022-03-31

Family

ID=80845431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022552108A Pending JPWO2022065496A1 (zh) 2020-09-28 2021-09-27

Country Status (5)

Country Link
JP (1) JPWO2022065496A1 (zh)
KR (1) KR20230075473A (zh)
CN (1) CN116348563A (zh)
TW (1) TW202212519A (zh)
WO (1) WO2022065496A1 (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3417354B2 (ja) * 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
JP5569126B2 (ja) * 2009-05-29 2014-08-13 日立化成株式会社 接着剤組成物、接着剤シート及び半導体装置の製造方法
JP2015003935A (ja) * 2011-10-20 2015-01-08 日立化成株式会社 接着剤組成物並びに接続構造体及びその製造方法
JP2014077122A (ja) * 2012-09-24 2014-05-01 Sekisui Chem Co Ltd 電子部品用接着剤及び半導体チップ実装体の製造方法
WO2015151514A1 (ja) * 2014-03-31 2015-10-08 ナガセケムテックス株式会社 中空部を有する回路部材および実装構造体、ならびに実装構造体の製造方法
JP2016054288A (ja) 2014-09-02 2016-04-14 デクセリアルズ株式会社 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品
WO2018034234A1 (ja) * 2016-08-19 2018-02-22 住友ベークライト株式会社 ダイアタッチペーストおよび半導体装置
JPWO2019050006A1 (ja) * 2017-09-11 2020-08-20 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP7308028B2 (ja) * 2018-12-27 2023-07-13 ククド アドバンスト マテリアルズ カンパニー リミテッド 異方性導電フィルム、その硬化物および異方性導電フィルムの製造方法

Also Published As

Publication number Publication date
KR20230075473A (ko) 2023-05-31
CN116348563A (zh) 2023-06-27
WO2022065496A1 (ja) 2022-03-31
TW202212519A (zh) 2022-04-01

Similar Documents

Publication Publication Date Title
BR112023005462A2 (zh)
BR112023012656A2 (zh)
JPWO2022102573A1 (zh)
BR112022024743A2 (zh)
JPWO2022107800A1 (zh)
JPWO2022059647A1 (zh)
BR112022009896A2 (zh)
BR102021007058A2 (zh)
BR112023011738A2 (zh)
BR112023016292A2 (zh)
BR112023011539A2 (zh)
BR112023011610A2 (zh)
BR112023008976A2 (zh)
BR112023009656A2 (zh)
BR112023006729A2 (zh)
JPWO2022075370A1 (zh)
JPWO2022065496A1 (zh)
BR102021016375A2 (zh)
BR102021016200A2 (zh)
BR202021013683U2 (zh)
BR112021017747A2 (zh)
BR102021012571A2 (zh)
BR102021012230A2 (zh)
BR102021012107A2 (zh)
BR102021012003A2 (zh)