JPWO2022065338A1 - - Google Patents
Info
- Publication number
- JPWO2022065338A1 JPWO2022065338A1 JP2022552015A JP2022552015A JPWO2022065338A1 JP WO2022065338 A1 JPWO2022065338 A1 JP WO2022065338A1 JP 2022552015 A JP2022552015 A JP 2022552015A JP 2022552015 A JP2022552015 A JP 2022552015A JP WO2022065338 A1 JPWO2022065338 A1 JP WO2022065338A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020160985 | 2020-09-25 | ||
PCT/JP2021/034705 WO2022065338A1 (ja) | 2020-09-25 | 2021-09-22 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022065338A1 true JPWO2022065338A1 (ja) | 2022-03-31 |
Family
ID=80845428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022552015A Pending JPWO2022065338A1 (ja) | 2020-09-25 | 2021-09-22 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022065338A1 (ja) |
KR (1) | KR20230054708A (ja) |
TW (1) | TW202219161A (ja) |
WO (1) | WO2022065338A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009145158A1 (ja) * | 2008-05-29 | 2009-12-03 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置 |
WO2010001780A1 (ja) * | 2008-07-03 | 2010-01-07 | 旭化成イーマテリアルズ株式会社 | 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物 |
JP2012514760A (ja) * | 2009-10-15 | 2012-06-28 | エルジー・ケム・リミテッド | 感光性樹脂組成物およびこれを含むドライフィルム |
WO2015052885A1 (ja) * | 2013-10-09 | 2015-04-16 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体を含む樹脂組成物、及びそれを用いた硬化膜の製造方法 |
WO2020054226A1 (ja) * | 2018-09-10 | 2020-03-19 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス |
JP2020154205A (ja) * | 2019-03-22 | 2020-09-24 | 富士フイルム株式会社 | パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス |
JP2020152857A (ja) * | 2019-03-22 | 2020-09-24 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4789657B2 (ja) | 2006-03-13 | 2011-10-12 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP5755544B2 (ja) | 2011-09-30 | 2015-07-29 | 三洋化成工業株式会社 | 感光性樹脂組成物 |
-
2021
- 2021-09-17 TW TW110134956A patent/TW202219161A/zh unknown
- 2021-09-22 JP JP2022552015A patent/JPWO2022065338A1/ja active Pending
- 2021-09-22 KR KR1020237009828A patent/KR20230054708A/ko unknown
- 2021-09-22 WO PCT/JP2021/034705 patent/WO2022065338A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009145158A1 (ja) * | 2008-05-29 | 2009-12-03 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置 |
WO2010001780A1 (ja) * | 2008-07-03 | 2010-01-07 | 旭化成イーマテリアルズ株式会社 | 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物 |
JP2012514760A (ja) * | 2009-10-15 | 2012-06-28 | エルジー・ケム・リミテッド | 感光性樹脂組成物およびこれを含むドライフィルム |
WO2015052885A1 (ja) * | 2013-10-09 | 2015-04-16 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体を含む樹脂組成物、及びそれを用いた硬化膜の製造方法 |
WO2020054226A1 (ja) * | 2018-09-10 | 2020-03-19 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス |
JP2020154205A (ja) * | 2019-03-22 | 2020-09-24 | 富士フイルム株式会社 | パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス |
JP2020152857A (ja) * | 2019-03-22 | 2020-09-24 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
Also Published As
Publication number | Publication date |
---|---|
WO2022065338A1 (ja) | 2022-03-31 |
TW202219161A (zh) | 2022-05-16 |
KR20230054708A (ko) | 2023-04-25 |
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