JPWO2022054685A1 - - Google Patents

Info

Publication number
JPWO2022054685A1
JPWO2022054685A1 JP2022542067A JP2022542067A JPWO2022054685A1 JP WO2022054685 A1 JPWO2022054685 A1 JP WO2022054685A1 JP 2022542067 A JP2022542067 A JP 2022542067A JP 2022542067 A JP2022542067 A JP 2022542067A JP WO2022054685 A1 JPWO2022054685 A1 JP WO2022054685A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022542067A
Other versions
JP7223917B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022054685A1 publication Critical patent/JPWO2022054685A1/ja
Application granted granted Critical
Publication of JP7223917B2 publication Critical patent/JP7223917B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2022542067A 2020-09-10 2021-09-02 積層体、放熱構造体及び半導体モジュール Active JP7223917B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020151972 2020-09-10
JP2020151972 2020-09-10
PCT/JP2021/032286 WO2022054685A1 (ja) 2020-09-10 2021-09-02 積層体、放熱構造体及び半導体モジュール

Publications (2)

Publication Number Publication Date
JPWO2022054685A1 true JPWO2022054685A1 (ja) 2022-03-17
JP7223917B2 JP7223917B2 (ja) 2023-02-16

Family

ID=80632311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542067A Active JP7223917B2 (ja) 2020-09-10 2021-09-02 積層体、放熱構造体及び半導体モジュール

Country Status (2)

Country Link
JP (1) JP7223917B2 (ja)
WO (1) WO2022054685A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054099A (ja) * 2003-08-06 2005-03-03 Denki Kagaku Kogyo Kk 熱伝導性グリース
JP2007299973A (ja) * 2006-05-01 2007-11-15 Hitachi Metals Ltd 回路基板およびこれを用いた半導体モジュール
JP2011020870A (ja) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd 酸化マグネシウム粒子、その製造方法、放熱性フィラー、樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP2013122993A (ja) * 2011-12-12 2013-06-20 Toyota Motor Corp 半導体装置
JP2020061427A (ja) * 2018-10-09 2020-04-16 トヨタ自動車株式会社 半導体モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054099A (ja) * 2003-08-06 2005-03-03 Denki Kagaku Kogyo Kk 熱伝導性グリース
JP2007299973A (ja) * 2006-05-01 2007-11-15 Hitachi Metals Ltd 回路基板およびこれを用いた半導体モジュール
JP2011020870A (ja) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd 酸化マグネシウム粒子、その製造方法、放熱性フィラー、樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP2013122993A (ja) * 2011-12-12 2013-06-20 Toyota Motor Corp 半導体装置
JP2020061427A (ja) * 2018-10-09 2020-04-16 トヨタ自動車株式会社 半導体モジュール

Also Published As

Publication number Publication date
WO2022054685A1 (ja) 2022-03-17
JP7223917B2 (ja) 2023-02-16

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