JPWO2022054605A1 - - Google Patents

Info

Publication number
JPWO2022054605A1
JPWO2022054605A1 JP2022547500A JP2022547500A JPWO2022054605A1 JP WO2022054605 A1 JPWO2022054605 A1 JP WO2022054605A1 JP 2022547500 A JP2022547500 A JP 2022547500A JP 2022547500 A JP2022547500 A JP 2022547500A JP WO2022054605 A1 JPWO2022054605 A1 JP WO2022054605A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022547500A
Other versions
JPWO2022054605A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022054605A1 publication Critical patent/JPWO2022054605A1/ja
Publication of JPWO2022054605A5 publication Critical patent/JPWO2022054605A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0691—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of objects while moving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/42—Caliper-like sensors with one or more detectors on a single side of the object to be measured and with a backing surface of support or reference on the other side

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022547500A 2020-09-10 2021-08-27 Pending JPWO2022054605A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020152049 2020-09-10
JP2020196984 2020-11-27
PCT/JP2021/031465 WO2022054605A1 (ja) 2020-09-10 2021-08-27 厚み測定装置及び厚み測定方法

Publications (2)

Publication Number Publication Date
JPWO2022054605A1 true JPWO2022054605A1 (ja) 2022-03-17
JPWO2022054605A5 JPWO2022054605A5 (ja) 2023-06-06

Family

ID=80631620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547500A Pending JPWO2022054605A1 (ja) 2020-09-10 2021-08-27

Country Status (4)

Country Link
US (1) US20230341224A1 (ja)
JP (1) JPWO2022054605A1 (ja)
CN (1) CN116018497A (ja)
WO (1) WO2022054605A1 (ja)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186101A (en) * 1981-05-12 1982-11-16 Toshiba Corp Thickness measuring device
JPH0649958U (ja) * 1992-10-01 1994-07-08 京セラ株式会社 半導体ウェハ厚さ測定機
JPH0911121A (ja) * 1995-06-22 1997-01-14 San Buraito:Kk 平面ラップ盤
US5670888A (en) * 1992-11-25 1997-09-23 Cheng; David Method for transporting and testing wafers
JP2003031644A (ja) * 2001-07-18 2003-01-31 Canon Inc 半導体製造装置
JP2003075124A (ja) * 2001-09-06 2003-03-12 Okamoto Machine Tool Works Ltd ウエハの厚み測定装置
JP2009139092A (ja) * 2007-12-03 2009-06-25 Justem:Kk 静電容量式厚み多点測定方法及びその装置
JP2009156686A (ja) * 2007-12-26 2009-07-16 Kobelco Kaken:Kk 形状測定装置，形状測定方法
JP2015116637A (ja) * 2013-12-18 2015-06-25 株式会社ディスコ 研削方法
JP2015205367A (ja) * 2014-04-21 2015-11-19 株式会社ディスコ 研削装置
JP2018012166A (ja) * 2016-07-21 2018-01-25 スピードファム株式会社 研磨装置
JP2020134587A (ja) * 2019-02-14 2020-08-31 キヤノン株式会社 計測装置、露光装置、および物品製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186101A (en) * 1981-05-12 1982-11-16 Toshiba Corp Thickness measuring device
JPH0649958U (ja) * 1992-10-01 1994-07-08 京セラ株式会社 半導体ウェハ厚さ測定機
US5670888A (en) * 1992-11-25 1997-09-23 Cheng; David Method for transporting and testing wafers
JPH0911121A (ja) * 1995-06-22 1997-01-14 San Buraito:Kk 平面ラップ盤
JP2003031644A (ja) * 2001-07-18 2003-01-31 Canon Inc 半導体製造装置
JP2003075124A (ja) * 2001-09-06 2003-03-12 Okamoto Machine Tool Works Ltd ウエハの厚み測定装置
JP2009139092A (ja) * 2007-12-03 2009-06-25 Justem:Kk 静電容量式厚み多点測定方法及びその装置
JP2009156686A (ja) * 2007-12-26 2009-07-16 Kobelco Kaken:Kk 形状測定装置，形状測定方法
JP2015116637A (ja) * 2013-12-18 2015-06-25 株式会社ディスコ 研削方法
JP2015205367A (ja) * 2014-04-21 2015-11-19 株式会社ディスコ 研削装置
JP2018012166A (ja) * 2016-07-21 2018-01-25 スピードファム株式会社 研磨装置
JP2020134587A (ja) * 2019-02-14 2020-08-31 キヤノン株式会社 計測装置、露光装置、および物品製造方法

Also Published As

Publication number Publication date
US20230341224A1 (en) 2023-10-26
WO2022054605A1 (ja) 2022-03-17
CN116018497A (zh) 2023-04-25

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