JPWO2022050170A1 - - Google Patents

Info

Publication number
JPWO2022050170A1
JPWO2022050170A1 JP2022546280A JP2022546280A JPWO2022050170A1 JP WO2022050170 A1 JPWO2022050170 A1 JP WO2022050170A1 JP 2022546280 A JP2022546280 A JP 2022546280A JP 2022546280 A JP2022546280 A JP 2022546280A JP WO2022050170 A1 JPWO2022050170 A1 JP WO2022050170A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022546280A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022050170A1 publication Critical patent/JPWO2022050170A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022546280A 2020-09-03 2021-08-26 Pending JPWO2022050170A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020148137 2020-09-03
PCT/JP2021/031378 WO2022050170A1 (ja) 2020-09-03 2021-08-26 コンパウンド、成形体、及びコンパウンドの硬化物

Publications (1)

Publication Number Publication Date
JPWO2022050170A1 true JPWO2022050170A1 (zh) 2022-03-10

Family

ID=80491720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546280A Pending JPWO2022050170A1 (zh) 2020-09-03 2021-08-26

Country Status (5)

Country Link
JP (1) JPWO2022050170A1 (zh)
KR (1) KR20230061411A (zh)
CN (1) CN116134084A (zh)
TW (1) TW202219168A (zh)
WO (1) WO2022050170A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4227340A4 (en) * 2020-10-05 2024-10-02 Sumitomo Bakelite Co RESIN MOLDING MATERIAL, MOLDED BODY AND METHOD FOR PRODUCING SAID MOLDED BODY

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6159512B2 (ja) 2012-07-04 2017-07-05 太陽誘電株式会社 インダクタ
DE102013113885A1 (de) * 2013-12-11 2015-06-11 Eckart Gmbh Beschichtete Metallpigmente, Verfahren zu deren Herstellung und deren Verwendung, Beschichtungsmittel und Gegenstand
JP6606920B2 (ja) * 2015-08-26 2019-11-20 日亜化学工業株式会社 表面処理された希土類系磁性粉末及びその製造方法並びにボンド磁石及びその製造方法
CN116751438A (zh) * 2017-09-15 2023-09-15 株式会社力森诺科 环氧树脂组合物和电子部件装置
JP7136121B2 (ja) * 2017-11-30 2022-09-13 昭和電工マテリアルズ株式会社 コンパウンド粉
JP2019104954A (ja) * 2017-12-11 2019-06-27 日立化成株式会社 金属元素含有粉及び成形体
US20200391287A1 (en) * 2018-02-28 2020-12-17 Hitachi Chemical Company, Ltd. Compound powder
SG11202008967WA (en) * 2018-03-16 2020-10-29 Hitachi Chemical Co Ltd Epoxy resin composition and electronic component device
JP7222394B2 (ja) * 2018-04-13 2023-02-15 株式会社レゾナック コンパウンド及び成形体
CN112166154B (zh) * 2018-05-31 2024-02-20 株式会社力森诺科 复合物及成形体

Also Published As

Publication number Publication date
TW202219168A (zh) 2022-05-16
WO2022050170A1 (ja) 2022-03-10
KR20230061411A (ko) 2023-05-08
CN116134084A (zh) 2023-05-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240610