JPWO2022030001A1 - - Google Patents

Info

Publication number
JPWO2022030001A1
JPWO2022030001A1 JP2022541081A JP2022541081A JPWO2022030001A1 JP WO2022030001 A1 JPWO2022030001 A1 JP WO2022030001A1 JP 2022541081 A JP2022541081 A JP 2022541081A JP 2022541081 A JP2022541081 A JP 2022541081A JP WO2022030001 A1 JPWO2022030001 A1 JP WO2022030001A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022541081A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022030001A1 publication Critical patent/JPWO2022030001A1/ja
Priority to JP2024144161A priority Critical patent/JP2024167291A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
JP2022541081A 2020-08-07 2020-08-07 Pending JPWO2022030001A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024144161A JP2024167291A (ja) 2020-08-07 2024-08-26 光半導体モジュールおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/030394 WO2022030001A1 (ja) 2020-08-07 2020-08-07 光半導体モジュールおよびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024144161A Division JP2024167291A (ja) 2020-08-07 2024-08-26 光半導体モジュールおよびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022030001A1 true JPWO2022030001A1 (https=) 2022-02-10

Family

ID=80117215

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022541081A Pending JPWO2022030001A1 (https=) 2020-08-07 2020-08-07
JP2024144161A Pending JP2024167291A (ja) 2020-08-07 2024-08-26 光半導体モジュールおよびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024144161A Pending JP2024167291A (ja) 2020-08-07 2024-08-26 光半導体モジュールおよびその製造方法

Country Status (3)

Country Link
US (1) US20230314740A1 (https=)
JP (2) JPWO2022030001A1 (https=)
WO (1) WO2022030001A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230308787A1 (en) * 2022-03-23 2023-09-28 Mellanox Technologies, Ltd. Hybrid optoelectrical switches
JPWO2024075171A1 (https=) * 2022-10-03 2024-04-11
WO2025004320A1 (ja) * 2023-06-30 2025-01-02 日本電信電話株式会社 光電気モジュール
CN121399519A (zh) * 2023-06-30 2026-01-23 恩梯梯株式会社 光电模块
US20250216600A1 (en) * 2023-12-28 2025-07-03 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming an integrated optical chip package device and method of forming same
WO2025197594A1 (ja) * 2024-03-19 2025-09-25 古河電気工業株式会社 光トランシーバ、通信装置、及び基板アセンブリ

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245057A (ja) * 2005-02-28 2006-09-14 Sony Corp ハイブリットモジュール及びその製造方法並びにハイブリット回路装置
WO2008139763A1 (ja) * 2007-05-14 2008-11-20 Fujikura Ltd. 光通信モジュールとその製造方法及び光送受信装置
WO2010004850A1 (ja) * 2008-07-07 2010-01-14 日本電気株式会社 光配線構造
JP2011028111A (ja) * 2009-07-28 2011-02-10 Hitachi Ltd 光ｉ／ｏアレイモジュールおよびその製造方法
JP2011158666A (ja) * 2010-01-29 2011-08-18 Toshiba Corp 光電気フレキシブル配線モジュール及びその製造方法
US9698564B1 (en) * 2016-02-09 2017-07-04 Oracle International Corporation Hybrid integrated MCM with waveguide-fiber connector
JP2017198778A (ja) * 2016-04-26 2017-11-02 富士通株式会社 光配線実装構造、光モジュール、及び電子機器
JP2018049892A (ja) * 2016-09-20 2018-03-29 株式会社東芝 光半導体モジュール及びその製造方法
JP2019078795A (ja) * 2017-10-20 2019-05-23 株式会社東芝 光電子集積半導体モジュールおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3750649B2 (ja) * 2001-12-25 2006-03-01 住友電気工業株式会社 光通信装置
JP4810957B2 (ja) * 2005-02-28 2011-11-09 ソニー株式会社 ハイブリットモジュール及びその製造方法
JP4760127B2 (ja) * 2005-05-20 2011-08-31 住友ベークライト株式会社 光導波路構造体
JP2007287801A (ja) * 2006-04-13 2007-11-01 Sony Corp 電気・光混載三次元半導体モジュール及びハイブリット回路装置並びに携帯型電話機
JP2008021779A (ja) * 2006-07-12 2008-01-31 Fuji Xerox Co Ltd 積層型半導体パッケージおよび光信号伝送装置
JP6262551B2 (ja) * 2014-01-29 2018-01-17 京セラ株式会社 光モジュール
US10777430B2 (en) * 2018-06-27 2020-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Photonic integrated package and method forming same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245057A (ja) * 2005-02-28 2006-09-14 Sony Corp ハイブリットモジュール及びその製造方法並びにハイブリット回路装置
WO2008139763A1 (ja) * 2007-05-14 2008-11-20 Fujikura Ltd. 光通信モジュールとその製造方法及び光送受信装置
WO2010004850A1 (ja) * 2008-07-07 2010-01-14 日本電気株式会社 光配線構造
JP2011028111A (ja) * 2009-07-28 2011-02-10 Hitachi Ltd 光ｉ／ｏアレイモジュールおよびその製造方法
JP2011158666A (ja) * 2010-01-29 2011-08-18 Toshiba Corp 光電気フレキシブル配線モジュール及びその製造方法
US9698564B1 (en) * 2016-02-09 2017-07-04 Oracle International Corporation Hybrid integrated MCM with waveguide-fiber connector
JP2017198778A (ja) * 2016-04-26 2017-11-02 富士通株式会社 光配線実装構造、光モジュール、及び電子機器
JP2018049892A (ja) * 2016-09-20 2018-03-29 株式会社東芝 光半導体モジュール及びその製造方法
JP2019078795A (ja) * 2017-10-20 2019-05-23 株式会社東芝 光電子集積半導体モジュールおよびその製造方法

Also Published As

Publication number Publication date
WO2022030001A1 (ja) 2022-02-10
US20230314740A1 (en) 2023-10-05
JP2024167291A (ja) 2024-12-03

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