JPWO2022014316A1 - - Google Patents
Info
- Publication number
- JPWO2022014316A1 JPWO2022014316A1 JP2022536229A JP2022536229A JPWO2022014316A1 JP WO2022014316 A1 JPWO2022014316 A1 JP WO2022014316A1 JP 2022536229 A JP2022536229 A JP 2022536229A JP 2022536229 A JP2022536229 A JP 2022536229A JP WO2022014316 A1 JPWO2022014316 A1 JP WO2022014316A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020120768 | 2020-07-14 | ||
JP2020120768 | 2020-07-14 | ||
PCT/JP2021/024554 WO2022014316A1 (ja) | 2020-07-14 | 2021-06-29 | めっき電極、めっき装置およびめっき方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022014316A1 true JPWO2022014316A1 (zh) | 2022-01-20 |
JPWO2022014316A5 JPWO2022014316A5 (ja) | 2022-11-16 |
JP7345663B2 JP7345663B2 (ja) | 2023-09-15 |
Family
ID=79555413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022536229A Active JP7345663B2 (ja) | 2020-07-14 | 2021-06-29 | めっき装置およびめっき方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7345663B2 (zh) |
WO (1) | WO2022014316A1 (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4921220B1 (zh) * | 1970-12-23 | 1974-05-30 | ||
JPS506419B1 (zh) * | 1970-12-25 | 1975-03-13 | ||
JPS5224022U (zh) * | 1975-08-07 | 1977-02-19 | ||
JPS53142524U (zh) * | 1977-04-14 | 1978-11-10 | ||
JPS57171689A (en) * | 1981-04-13 | 1982-10-22 | Tokio Osaki | Plating device |
JPS61103475U (zh) * | 1984-12-14 | 1986-07-01 | ||
CN108315773A (zh) * | 2018-01-25 | 2018-07-24 | 郑州大学 | 一种精密3d打印金属微模具的方法及装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3312905C2 (de) * | 1983-04-11 | 1986-03-27 | Battelle-Institut E.V., 6000 Frankfurt | Vorrichtung zur galvanischen Innenbeschichtung von Hohlteilen |
JPH0635680B2 (ja) * | 1988-11-04 | 1994-05-11 | 川崎製鉄株式会社 | 金属材表面の局部電解処理装置 |
JP3291103B2 (ja) * | 1993-12-22 | 2002-06-10 | 住友特殊金属株式会社 | 連続表面処理装置 |
CN104775141B (zh) * | 2015-04-29 | 2017-04-12 | 江苏理工学院 | 零件内孔修复用电刷镀装置及方法 |
-
2021
- 2021-06-29 JP JP2022536229A patent/JP7345663B2/ja active Active
- 2021-06-29 WO PCT/JP2021/024554 patent/WO2022014316A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4921220B1 (zh) * | 1970-12-23 | 1974-05-30 | ||
JPS506419B1 (zh) * | 1970-12-25 | 1975-03-13 | ||
JPS5224022U (zh) * | 1975-08-07 | 1977-02-19 | ||
JPS53142524U (zh) * | 1977-04-14 | 1978-11-10 | ||
JPS57171689A (en) * | 1981-04-13 | 1982-10-22 | Tokio Osaki | Plating device |
JPS61103475U (zh) * | 1984-12-14 | 1986-07-01 | ||
CN108315773A (zh) * | 2018-01-25 | 2018-07-24 | 郑州大学 | 一种精密3d打印金属微模具的方法及装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2022014316A1 (ja) | 2022-01-20 |
JP7345663B2 (ja) | 2023-09-15 |
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