JPS4921220B1 - - Google Patents
Info
- Publication number
- JPS4921220B1 JPS4921220B1 JP11615570A JP11615570A JPS4921220B1 JP S4921220 B1 JPS4921220 B1 JP S4921220B1 JP 11615570 A JP11615570 A JP 11615570A JP 11615570 A JP11615570 A JP 11615570A JP S4921220 B1 JPS4921220 B1 JP S4921220B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11615570A JPS4921220B1 (zh) | 1970-12-23 | 1970-12-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11615570A JPS4921220B1 (zh) | 1970-12-23 | 1970-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4921220B1 true JPS4921220B1 (zh) | 1974-05-30 |
Family
ID=14680115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11615570A Pending JPS4921220B1 (zh) | 1970-12-23 | 1970-12-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4921220B1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50152212U (zh) * | 1974-06-04 | 1975-12-18 | ||
JPS5655191U (zh) * | 1979-10-03 | 1981-05-14 | ||
JPS5655190U (zh) * | 1979-10-03 | 1981-05-14 | ||
WO2001048274A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
JP2012219362A (ja) * | 2011-04-13 | 2012-11-12 | Toyota Motor Corp | 固体電解質膜を用いた金属膜形成方法 |
WO2022014316A1 (ja) * | 2020-07-14 | 2022-01-20 | 三菱電機株式会社 | めっき電極、めっき装置およびめっき方法 |
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1970
- 1970-12-23 JP JP11615570A patent/JPS4921220B1/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50152212U (zh) * | 1974-06-04 | 1975-12-18 | ||
JPS5655191U (zh) * | 1979-10-03 | 1981-05-14 | ||
JPS5655190U (zh) * | 1979-10-03 | 1981-05-14 | ||
WO2001048274A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
CN100422389C (zh) * | 1999-12-24 | 2008-10-01 | 株式会社荏原制作所 | 基片的电镀装置和电镀方法以及电解处理方法及其装置 |
JP2012219362A (ja) * | 2011-04-13 | 2012-11-12 | Toyota Motor Corp | 固体電解質膜を用いた金属膜形成方法 |
WO2022014316A1 (ja) * | 2020-07-14 | 2022-01-20 | 三菱電機株式会社 | めっき電極、めっき装置およびめっき方法 |
JPWO2022014316A1 (zh) * | 2020-07-14 | 2022-01-20 |