JPWO2022014106A1 - - Google Patents
Info
- Publication number
- JPWO2022014106A1 JPWO2022014106A1 JP2022536135A JP2022536135A JPWO2022014106A1 JP WO2022014106 A1 JPWO2022014106 A1 JP WO2022014106A1 JP 2022536135 A JP2022536135 A JP 2022536135A JP 2022536135 A JP2022536135 A JP 2022536135A JP WO2022014106 A1 JPWO2022014106 A1 JP WO2022014106A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020121652 | 2020-07-15 | ||
| JP2020217750 | 2020-12-25 | ||
| PCT/JP2021/013419 WO2022014106A1 (en) | 2020-07-15 | 2021-03-29 | Laser processing device and laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022014106A1 true JPWO2022014106A1 (en) | 2022-01-20 |
Family
ID=79554706
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022536136A Pending JPWO2022014107A1 (en) | 2020-07-15 | 2021-03-29 | |
| JP2022536135A Pending JPWO2022014106A1 (en) | 2020-07-15 | 2021-03-29 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022536136A Pending JPWO2022014107A1 (en) | 2020-07-15 | 2021-03-29 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JPWO2022014107A1 (en) |
| KR (2) | KR20230038462A (en) |
| CN (2) | CN116075388A (en) |
| TW (2) | TW202205400A (en) |
| WO (2) | WO2022014107A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5775265B2 (en) * | 2009-08-03 | 2015-09-09 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor device manufacturing method |
| JP5456510B2 (en) | 2010-02-23 | 2014-04-02 | 株式会社ディスコ | Laser processing equipment |
| JP5389264B2 (en) * | 2010-07-26 | 2014-01-15 | 浜松ホトニクス株式会社 | Laser processing method |
| JP2013089714A (en) * | 2011-10-17 | 2013-05-13 | Disco Abrasive Syst Ltd | Chip formation method |
| JP5995563B2 (en) * | 2012-07-11 | 2016-09-21 | 株式会社ディスコ | Optical device processing method |
| JP7285067B2 (en) * | 2018-10-30 | 2023-06-01 | 浜松ホトニクス株式会社 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
| KR102248637B1 (en) | 2018-12-07 | 2021-05-06 | 임유택 | Width adjustment for the cultivator |
-
2021
- 2021-03-29 KR KR1020237000696A patent/KR20230038462A/en unknown
- 2021-03-29 CN CN202180060970.9A patent/CN116075388A/en active Pending
- 2021-03-29 KR KR1020237000695A patent/KR20230038461A/en unknown
- 2021-03-29 JP JP2022536136A patent/JPWO2022014107A1/ja active Pending
- 2021-03-29 CN CN202180060941.2A patent/CN116113517A/en active Pending
- 2021-03-29 WO PCT/JP2021/013420 patent/WO2022014107A1/en active Application Filing
- 2021-03-29 JP JP2022536135A patent/JPWO2022014106A1/ja active Pending
- 2021-03-29 WO PCT/JP2021/013419 patent/WO2022014106A1/en active Application Filing
- 2021-03-30 TW TW110111575A patent/TW202205400A/en unknown
- 2021-03-30 TW TW110111576A patent/TW202205401A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230038461A (en) | 2023-03-20 |
| JPWO2022014107A1 (en) | 2022-01-20 |
| TW202205401A (en) | 2022-02-01 |
| KR20230038462A (en) | 2023-03-20 |
| CN116113517A (en) | 2023-05-12 |
| WO2022014107A1 (en) | 2022-01-20 |
| WO2022014106A1 (en) | 2022-01-20 |
| TW202205400A (en) | 2022-02-01 |
| CN116075388A (en) | 2023-05-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231109 |