JPWO2022004756A1 - - Google Patents

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Publication number
JPWO2022004756A1
JPWO2022004756A1 JP2022534065A JP2022534065A JPWO2022004756A1 JP WO2022004756 A1 JPWO2022004756 A1 JP WO2022004756A1 JP 2022534065 A JP2022534065 A JP 2022534065A JP 2022534065 A JP2022534065 A JP 2022534065A JP WO2022004756 A1 JPWO2022004756 A1 JP WO2022004756A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022534065A
Other versions
JP7414143B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022004756A1 publication Critical patent/JPWO2022004756A1/ja
Application granted granted Critical
Publication of JP7414143B2 publication Critical patent/JP7414143B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022534065A 2020-06-30 2021-06-29 樹脂組成物 Active JP7414143B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020113525 2020-06-30
JP2020113525 2020-06-30
PCT/JP2021/024644 WO2022004756A1 (ja) 2020-06-30 2021-06-29 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022004756A1 true JPWO2022004756A1 (ja) 2022-01-06
JP7414143B2 JP7414143B2 (ja) 2024-01-16

Family

ID=79316521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534065A Active JP7414143B2 (ja) 2020-06-30 2021-06-29 樹脂組成物

Country Status (3)

Country Link
JP (1) JP7414143B2 (ja)
CN (1) CN115698188B (ja)
WO (1) WO2022004756A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109810A (ja) * 1985-11-06 1987-05-21 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物
JPS63273644A (ja) * 1987-05-02 1988-11-10 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物
JPS63273643A (ja) * 1987-05-02 1988-11-10 Sumitomo Chem Co Ltd トリアジン環含有樹脂
US6114489A (en) * 1997-03-27 2000-09-05 Herberts Gmbh Reactive hyperbranched polymers for powder coatings
JP2018083786A (ja) * 2016-11-25 2018-05-31 Dic株式会社 フェノール性水酸基含有化合物及びレジスト材料
JP2019172917A (ja) * 2018-03-29 2019-10-10 旭化成株式会社 ポリフェニレンエーテル、ポリフェニレンエーテル組成物、硬化剤組成物、及びポリフェニレンエーテルの製造方法
JP2020071262A (ja) * 2018-10-29 2020-05-07 日鉄ケミカル＆マテリアル株式会社 隔壁用感光性樹脂組成物及びその硬化物並びにその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010128661A1 (ja) * 2009-05-07 2010-11-11 日産化学工業株式会社 トリアジン環含有重合体およびそれを含む膜形成用組成物
JP6992333B2 (ja) * 2017-09-06 2022-01-13 味の素株式会社 樹脂組成物
WO2019198607A1 (ja) * 2018-04-09 2019-10-17 日本化薬株式会社 アルケニル基含有化合物、硬化性樹脂組成物及びその硬化物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109810A (ja) * 1985-11-06 1987-05-21 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物
JPS63273644A (ja) * 1987-05-02 1988-11-10 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物
JPS63273643A (ja) * 1987-05-02 1988-11-10 Sumitomo Chem Co Ltd トリアジン環含有樹脂
US6114489A (en) * 1997-03-27 2000-09-05 Herberts Gmbh Reactive hyperbranched polymers for powder coatings
JP2018083786A (ja) * 2016-11-25 2018-05-31 Dic株式会社 フェノール性水酸基含有化合物及びレジスト材料
JP2019172917A (ja) * 2018-03-29 2019-10-10 旭化成株式会社 ポリフェニレンエーテル、ポリフェニレンエーテル組成物、硬化剤組成物、及びポリフェニレンエーテルの製造方法
JP2020071262A (ja) * 2018-10-29 2020-05-07 日鉄ケミカル＆マテリアル株式会社 隔壁用感光性樹脂組成物及びその硬化物並びにその製造方法

Also Published As

Publication number Publication date
JP7414143B2 (ja) 2024-01-16
CN115698188B (zh) 2024-08-13
WO2022004756A1 (ja) 2022-01-06
CN115698188A (zh) 2023-02-03

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