JPWO2021256220A1 - - Google Patents
Info
- Publication number
- JPWO2021256220A1 JPWO2021256220A1 JP2022532455A JP2022532455A JPWO2021256220A1 JP WO2021256220 A1 JPWO2021256220 A1 JP WO2021256220A1 JP 2022532455 A JP2022532455 A JP 2022532455A JP 2022532455 A JP2022532455 A JP 2022532455A JP WO2021256220 A1 JPWO2021256220 A1 JP WO2021256220A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/02—Flexible elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020106514 | 2020-06-19 | ||
JP2020106514 | 2020-06-19 | ||
PCT/JP2021/020410 WO2021256220A1 (ja) | 2020-06-19 | 2021-05-28 | 熱伝導体及び熱伝導体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021256220A1 true JPWO2021256220A1 (ja) | 2021-12-23 |
JP7345222B2 JP7345222B2 (ja) | 2023-09-15 |
Family
ID=79267904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022532455A Active JP7345222B2 (ja) | 2020-06-19 | 2021-05-28 | 熱伝導体及び熱伝導体の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11864355B2 (ja) |
JP (1) | JP7345222B2 (ja) |
CN (1) | CN115362548A (ja) |
TW (1) | TW202208591A (ja) |
WO (1) | WO2021256220A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009055021A (ja) * | 2007-08-01 | 2009-03-12 | Hitachi Chem Co Ltd | 熱伝導シート及びその製造方法 |
WO2017086487A1 (ja) * | 2015-11-20 | 2017-05-26 | リンテック株式会社 | シートの製造方法 |
JP2017141464A (ja) * | 2011-12-28 | 2017-08-17 | 日立化成株式会社 | 樹脂組成物、樹脂組成物シート及び樹脂組成物シートの製造方法、金属箔付樹脂組成物シート、bステージシート、半硬化の金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、led光源部材、並びにパワー半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2672247C2 (ru) | 2014-09-22 | 2018-11-13 | Дау Глоубл Текнолоджиз Ллк | Теплопроводная паста на основе сверхразветвленной олефиновой текучей среды |
KR102087163B1 (ko) * | 2014-12-18 | 2020-03-10 | 가부시키가이샤 가네카 | 그래파이트 적층체, 그래파이트 적층체의 제조 방법, 열 수송용 구조물 및 로드상의 열 수송체 |
JP6854401B2 (ja) * | 2015-12-22 | 2021-04-07 | パナソニックIpマネジメント株式会社 | 導体接合体およびそれを用いた電子部品ならびにそれらの製造方法 |
EP3934377A4 (en) * | 2019-02-26 | 2022-11-23 | Dai Nippon Printing Co., Ltd. | SAMPLE CONDUCTOR, HEAT-GENERATING PLATE AND MOBILE BODY |
JP2022048812A (ja) * | 2020-09-15 | 2022-03-28 | Dowaメタルテック株式会社 | 放熱部材およびその製造方法 |
-
2021
- 2021-05-28 WO PCT/JP2021/020410 patent/WO2021256220A1/ja active Application Filing
- 2021-05-28 CN CN202180025392.5A patent/CN115362548A/zh active Pending
- 2021-05-28 US US17/923,149 patent/US11864355B2/en active Active
- 2021-05-28 JP JP2022532455A patent/JP7345222B2/ja active Active
- 2021-05-28 TW TW110119498A patent/TW202208591A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009055021A (ja) * | 2007-08-01 | 2009-03-12 | Hitachi Chem Co Ltd | 熱伝導シート及びその製造方法 |
JP2017141464A (ja) * | 2011-12-28 | 2017-08-17 | 日立化成株式会社 | 樹脂組成物、樹脂組成物シート及び樹脂組成物シートの製造方法、金属箔付樹脂組成物シート、bステージシート、半硬化の金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、led光源部材、並びにパワー半導体装置 |
WO2017086487A1 (ja) * | 2015-11-20 | 2017-05-26 | リンテック株式会社 | シートの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202208591A (zh) | 2022-03-01 |
CN115362548A (zh) | 2022-11-18 |
US11864355B2 (en) | 2024-01-02 |
JP7345222B2 (ja) | 2023-09-15 |
US20230328929A1 (en) | 2023-10-12 |
WO2021256220A1 (ja) | 2021-12-23 |
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