JPWO2021256172A1 - - Google Patents
Info
- Publication number
- JPWO2021256172A1 JPWO2021256172A1 JP2022532421A JP2022532421A JPWO2021256172A1 JP WO2021256172 A1 JPWO2021256172 A1 JP WO2021256172A1 JP 2022532421 A JP2022532421 A JP 2022532421A JP 2022532421 A JP2022532421 A JP 2022532421A JP WO2021256172 A1 JPWO2021256172 A1 JP WO2021256172A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020103717 | 2020-06-16 | ||
JP2021085447 | 2021-05-20 | ||
PCT/JP2021/019414 WO2021256172A1 (ja) | 2020-06-16 | 2021-05-21 | SnZn半田およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021256172A1 true JPWO2021256172A1 (ko) | 2021-12-23 |
Family
ID=79267825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022532421A Pending JPWO2021256172A1 (ko) | 2020-06-16 | 2021-05-21 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021256172A1 (ko) |
TW (1) | TWI782572B (ko) |
WO (1) | WO2021256172A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114799612B (zh) * | 2022-05-27 | 2024-06-21 | 常州时创能源股份有限公司 | 一种光伏用钎焊焊料、其制备方法及应用 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6340639B2 (ko) * | 1981-12-10 | 1988-08-11 | Hitachi Ltd | |
WO1997012719A1 (fr) * | 1995-09-29 | 1997-04-10 | Matsushita Electric Industrial Co., Ltd. | Soudure sans plomb |
JPH09155587A (ja) * | 1995-11-30 | 1997-06-17 | Mitsui Mining & Smelting Co Ltd | 錫−亜鉛系無鉛半田合金 |
JPH10193172A (ja) * | 1996-12-16 | 1998-07-28 | Ford Motor Co | 鉛を含まない鑞組成物 |
WO2003061896A1 (fr) * | 2002-01-21 | 2003-07-31 | Fujitsu Limited | Alliage de brasage et joint brase |
WO2007004394A1 (ja) * | 2005-07-01 | 2007-01-11 | Nippon Mining & Metals Co., Ltd. | 高純度錫又は錫合金及び高純度錫の製造方法 |
CN101092006A (zh) * | 2006-06-21 | 2007-12-26 | 北京有色金属研究总院 | 一种微合金化锡锌共晶合金无铅焊料 |
JP2018111872A (ja) * | 2017-01-13 | 2018-07-19 | 古河電気工業株式会社 | 金属接合用材料、及び接合構造体 |
WO2018159306A1 (ja) * | 2017-02-28 | 2018-09-07 | アートビーム有限会社 | 太陽電池および太陽電池の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003010996A (ja) * | 2001-06-27 | 2003-01-15 | Nippon Filler Metals Co Ltd | 鉛フリーソルダペースト |
CN100462183C (zh) * | 2006-04-30 | 2009-02-18 | 东莞市中实焊锡有限公司 | 无铅抗氧化含稀土SnZn合金焊料及其制备方法 |
-
2021
- 2021-05-21 JP JP2022532421A patent/JPWO2021256172A1/ja active Pending
- 2021-05-21 WO PCT/JP2021/019414 patent/WO2021256172A1/ja active Application Filing
- 2021-06-10 TW TW110121193A patent/TWI782572B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6340639B2 (ko) * | 1981-12-10 | 1988-08-11 | Hitachi Ltd | |
WO1997012719A1 (fr) * | 1995-09-29 | 1997-04-10 | Matsushita Electric Industrial Co., Ltd. | Soudure sans plomb |
JPH09155587A (ja) * | 1995-11-30 | 1997-06-17 | Mitsui Mining & Smelting Co Ltd | 錫−亜鉛系無鉛半田合金 |
JPH10193172A (ja) * | 1996-12-16 | 1998-07-28 | Ford Motor Co | 鉛を含まない鑞組成物 |
WO2003061896A1 (fr) * | 2002-01-21 | 2003-07-31 | Fujitsu Limited | Alliage de brasage et joint brase |
WO2007004394A1 (ja) * | 2005-07-01 | 2007-01-11 | Nippon Mining & Metals Co., Ltd. | 高純度錫又は錫合金及び高純度錫の製造方法 |
CN101092006A (zh) * | 2006-06-21 | 2007-12-26 | 北京有色金属研究总院 | 一种微合金化锡锌共晶合金无铅焊料 |
JP2018111872A (ja) * | 2017-01-13 | 2018-07-19 | 古河電気工業株式会社 | 金属接合用材料、及び接合構造体 |
WO2018159306A1 (ja) * | 2017-02-28 | 2018-09-07 | アートビーム有限会社 | 太陽電池および太陽電池の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI782572B (zh) | 2022-11-01 |
WO2021256172A1 (ja) | 2021-12-23 |
TW202206613A (zh) | 2022-02-16 |
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