JPWO2021246458A1 - - Google Patents

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Publication number
JPWO2021246458A1
JPWO2021246458A1 JP2022528878A JP2022528878A JPWO2021246458A1 JP WO2021246458 A1 JPWO2021246458 A1 JP WO2021246458A1 JP 2022528878 A JP2022528878 A JP 2022528878A JP 2022528878 A JP2022528878 A JP 2022528878A JP WO2021246458 A1 JPWO2021246458 A1 JP WO2021246458A1
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JP
Japan
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JP2022528878A
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JP7470790B2 (ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
JP2022528878A 2020-06-03 2021-06-02 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Active JP7470790B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020097009 2020-06-03
JP2020097009 2020-06-03
PCT/JP2021/021068 WO2021246458A1 (ja) 2020-06-03 2021-06-02 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2021246458A1 true JPWO2021246458A1 (ja) 2021-12-09
JP7470790B2 JP7470790B2 (ja) 2024-04-18

Family

ID=78831190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528878A Active JP7470790B2 (ja) 2020-06-03 2021-06-02 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Country Status (4)

Country Link
JP (1) JP7470790B2 (ja)
KR (1) KR20230004846A (ja)
TW (1) TW202204476A (ja)
WO (1) WO2021246458A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114316288B (zh) * 2021-12-27 2023-03-03 重庆师范大学 一种绿色荧光高连接Cd4-有机配位聚合物及其制法与应用
WO2024048605A1 (ja) * 2022-08-31 2024-03-07 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001219667A (ja) * 1999-11-22 2001-08-14 Eastman Kodak Co 熱的に転換可能な組成物並びにオキソノールｉｒ色素を含有している像形成部材並びに像形成および印刷の方法
JP2003530595A (ja) * 2000-04-07 2003-10-14 イーストマン コダック カンパニー 改善された剥離強度を有する自立性画像形成アセンブリー
JP2007256345A (ja) * 2006-03-20 2007-10-04 Fujitsu Ltd 樹脂パターンの形成方法
WO2009025388A1 (ja) * 2007-08-21 2009-02-26 Jsr Corporation 液晶配向剤、液晶配向膜の製造方法および液晶表示素子
JP2011221549A (ja) * 2011-06-09 2011-11-04 Honeywell Internatl Inc フォトリソグラフィー用スピンオン反射防止膜
JP2013545142A (ja) * 2010-11-15 2013-12-19 インターナショナル・ビジネス・マシーンズ・コーポレーション ネガ型現像用のフォトレジスト組成物、およびそれを使用したパターン形成方法
JP2016191905A (ja) * 2015-03-30 2016-11-10 東京応化工業株式会社 感光性樹脂組成物、パターン形成方法、硬化膜、絶縁膜、カラーフィルタ、及び表示装置
WO2017073674A1 (ja) * 2015-10-30 2017-05-04 東レ株式会社 基板の製造方法およびそれを用いた発光素子の製造方法
JP2017181928A (ja) * 2016-03-31 2017-10-05 Jsr株式会社 ポジ型感放射線性樹脂組成物、層間絶縁膜、層間絶縁膜の形成方法、半導体素子及び表示素子
WO2017188047A1 (ja) * 2016-04-25 2017-11-02 東レ株式会社 樹脂組成物、その硬化膜およびその製造方法ならびに固体撮像素子
JP6418248B2 (ja) * 2015-09-30 2018-11-07 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052680B (zh) 2010-08-05 2016-05-25 日产化学工业株式会社 树脂组合物、液晶取向材及相位差材
JP7287119B2 (ja) 2018-06-01 2023-06-06 Jnc株式会社 光配向用液晶配向剤、液晶配向膜およびこれを用いた液晶表示素子

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001219667A (ja) * 1999-11-22 2001-08-14 Eastman Kodak Co 熱的に転換可能な組成物並びにオキソノールｉｒ色素を含有している像形成部材並びに像形成および印刷の方法
JP2003530595A (ja) * 2000-04-07 2003-10-14 イーストマン コダック カンパニー 改善された剥離強度を有する自立性画像形成アセンブリー
JP2007256345A (ja) * 2006-03-20 2007-10-04 Fujitsu Ltd 樹脂パターンの形成方法
WO2009025388A1 (ja) * 2007-08-21 2009-02-26 Jsr Corporation 液晶配向剤、液晶配向膜の製造方法および液晶表示素子
JP2013545142A (ja) * 2010-11-15 2013-12-19 インターナショナル・ビジネス・マシーンズ・コーポレーション ネガ型現像用のフォトレジスト組成物、およびそれを使用したパターン形成方法
JP2011221549A (ja) * 2011-06-09 2011-11-04 Honeywell Internatl Inc フォトリソグラフィー用スピンオン反射防止膜
JP2016191905A (ja) * 2015-03-30 2016-11-10 東京応化工業株式会社 感光性樹脂組成物、パターン形成方法、硬化膜、絶縁膜、カラーフィルタ、及び表示装置
JP6418248B2 (ja) * 2015-09-30 2018-11-07 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法
WO2017073674A1 (ja) * 2015-10-30 2017-05-04 東レ株式会社 基板の製造方法およびそれを用いた発光素子の製造方法
JP2017181928A (ja) * 2016-03-31 2017-10-05 Jsr株式会社 ポジ型感放射線性樹脂組成物、層間絶縁膜、層間絶縁膜の形成方法、半導体素子及び表示素子
WO2017188047A1 (ja) * 2016-04-25 2017-11-02 東レ株式会社 樹脂組成物、その硬化膜およびその製造方法ならびに固体撮像素子

Also Published As

Publication number Publication date
WO2021246458A1 (ja) 2021-12-09
TW202204476A (zh) 2022-02-01
KR20230004846A (ko) 2023-01-06
JP7470790B2 (ja) 2024-04-18

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