JPWO2021246331A1 - - Google Patents
Info
- Publication number
- JPWO2021246331A1 JPWO2021246331A1 JP2022528803A JP2022528803A JPWO2021246331A1 JP WO2021246331 A1 JPWO2021246331 A1 JP WO2021246331A1 JP 2022528803 A JP2022528803 A JP 2022528803A JP 2022528803 A JP2022528803 A JP 2022528803A JP WO2021246331 A1 JPWO2021246331 A1 JP WO2021246331A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020097789 | 2020-06-04 | ||
| PCT/JP2021/020444 WO2021246331A1 (ja) | 2020-06-04 | 2021-05-28 | 検査基板、その再生方法、および基板処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021246331A1 true JPWO2021246331A1 (zh) | 2021-12-09 |
Family
ID=78830515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022528803A Pending JPWO2021246331A1 (zh) | 2020-06-04 | 2021-05-28 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021246331A1 (zh) |
| TW (1) | TW202212812A (zh) |
| WO (1) | WO2021246331A1 (zh) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5218211A (en) * | 1991-10-23 | 1993-06-08 | The United States Of America As Represented By The Secretary Of Commerce | System for sampling the sizes, geometrical distribution, and frequency of small particles accumulating on a solid surface |
| KR100691570B1 (ko) * | 2000-10-05 | 2007-03-12 | 에이에스엠엘 유에스, 인크. | 탈착 가능한 센서 |
| JP2003231203A (ja) * | 2001-08-21 | 2003-08-19 | Toshiba Corp | 炭素膜被覆部材 |
| US6828542B2 (en) * | 2002-06-07 | 2004-12-07 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
| JP4726070B2 (ja) * | 2006-05-23 | 2011-07-20 | 東京エレクトロン株式会社 | 基板処理装置、装置検査方法、装置検査プログラム、及びそのプログラムを記録した記録媒体 |
| US8823933B2 (en) * | 2006-09-29 | 2014-09-02 | Cyberoptics Corporation | Substrate-like particle sensor |
| JP6114129B2 (ja) * | 2013-07-09 | 2017-04-12 | 株式会社ニューフレアテクノロジー | パーティクル測定方法 |
| US10067070B2 (en) * | 2015-11-06 | 2018-09-04 | Applied Materials, Inc. | Particle monitoring device |
| JP7080134B2 (ja) * | 2018-08-07 | 2022-06-03 | 東京エレクトロン株式会社 | 基板処理装置のパーティクル除去方法および基板処理装置 |
-
2021
- 2021-05-25 TW TW110118819A patent/TW202212812A/zh unknown
- 2021-05-28 JP JP2022528803A patent/JPWO2021246331A1/ja active Pending
- 2021-05-28 WO PCT/JP2021/020444 patent/WO2021246331A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021246331A1 (ja) | 2021-12-09 |
| TW202212812A (zh) | 2022-04-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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| A131 | Notification of reasons for refusal |
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| A521 | Request for written amendment filed |
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