JPWO2021245467A5 - - Google Patents
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- Publication number
- JPWO2021245467A5 JPWO2021245467A5 JP2022572608A JP2022572608A JPWO2021245467A5 JP WO2021245467 A5 JPWO2021245467 A5 JP WO2021245467A5 JP 2022572608 A JP2022572608 A JP 2022572608A JP 2022572608 A JP2022572608 A JP 2022572608A JP WO2021245467 A5 JPWO2021245467 A5 JP WO2021245467A5
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pulses
- droplets
- bump
- target location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 40
- 239000000463 material Substances 0.000 claims 26
- 239000000758 substrate Substances 0.000 claims 26
- 238000000034 method Methods 0.000 claims 19
- 239000000203 mixture Substances 0.000 claims 16
- 230000005855 radiation Effects 0.000 claims 9
- 238000000151 deposition Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 4
- 230000001939 inductive effect Effects 0.000 claims 2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063034422P | 2020-06-04 | 2020-06-04 | |
| US63/034,422 | 2020-06-04 | ||
| US17/162,835 | 2021-01-29 | ||
| US17/162,835 US11627667B2 (en) | 2021-01-29 | 2021-01-29 | High-resolution soldering |
| PCT/IB2021/051530 WO2021245467A1 (en) | 2020-06-04 | 2021-02-24 | High-resolution soldering |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023529317A JP2023529317A (ja) | 2023-07-10 |
| JPWO2021245467A5 true JPWO2021245467A5 (ko) | 2023-12-12 |
| JP7411829B2 JP7411829B2 (ja) | 2024-01-11 |
Family
ID=78831608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022572608A Active JP7411829B2 (ja) | 2020-06-04 | 2021-02-24 | 高分解能ソルダリング |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7411829B2 (ko) |
| KR (1) | KR102668012B1 (ko) |
| CN (1) | CN115702488A (ko) |
| TW (1) | TW202146255A (ko) |
| WO (1) | WO2021245467A1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GR20220100986A (el) * | 2022-11-30 | 2024-06-11 | Πρισμα Ηλεκτρονικα Α.Β.Ε.Ε Και Δ.Τ. "Prisma Electronics S.A., | Συστημα και μεθοδος αναγνωρισης προτυπων για τη συναρμολογηση πλακετων τυπωμενων κυκλωματων με ψηφιακη εκτυπωση |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7682970B2 (en) * | 2003-07-16 | 2010-03-23 | The Regents Of The University Of California | Maskless nanofabrication of electronic components |
| EP2731126A1 (en) * | 2012-11-09 | 2014-05-14 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method for bonding bare chip dies |
| JP6619335B2 (ja) * | 2013-10-14 | 2019-12-11 | オルボテック リミテッド | 複数組成材料構造体のｌｉｆｔ印刷 |
| TWI636896B (zh) * | 2013-10-30 | 2018-10-01 | 荷蘭Ｔｎｏ自然科學組織公司 | 用以在基材上形成圖案化結構之方法與系統 |
| US9508667B2 (en) * | 2014-12-23 | 2016-11-29 | Intel Corporation | Formation of solder and copper interconnect structures and associated techniques and configurations |
| TW201901887A (zh) * | 2017-05-24 | 2019-01-01 | 以色列商奧寶科技股份有限公司 | 於未事先圖樣化基板上電器互連電路元件 |
| CN108018549A (zh) | 2017-10-24 | 2018-05-11 | 广东工业大学 | 一种基于激光诱导喷嘴的多维微细结构沉积方法 |
| EP3521483A1 (en) * | 2018-02-06 | 2019-08-07 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Lift deposition apparatus and method |
| EP3659728B1 (en) * | 2018-11-29 | 2021-01-27 | Ivoclar Vivadent AG | Method for layer-wise additive manufacturing of a shaped body |
| CN109581674B (zh) * | 2019-01-04 | 2020-04-28 | 华南理工大学 | 一种锡膏激光诱导前向转移设备与方法 |
-
2021
- 2021-02-24 WO PCT/IB2021/051530 patent/WO2021245467A1/en active Application Filing
- 2021-02-24 KR KR1020227044115A patent/KR102668012B1/ko active IP Right Grant
- 2021-02-24 JP JP2022572608A patent/JP7411829B2/ja active Active
- 2021-02-24 CN CN202180039742.3A patent/CN115702488A/zh active Pending
- 2021-04-09 TW TW110112858A patent/TW202146255A/zh unknown
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