JPWO2021235214A1 - - Google Patents

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Publication number
JPWO2021235214A1
JPWO2021235214A1 JP2022524364A JP2022524364A JPWO2021235214A1 JP WO2021235214 A1 JPWO2021235214 A1 JP WO2021235214A1 JP 2022524364 A JP2022524364 A JP 2022524364A JP 2022524364 A JP2022524364 A JP 2022524364A JP WO2021235214 A1 JPWO2021235214 A1 JP WO2021235214A1
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JP
Japan
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JP2022524364A
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JP7371249B2 (ja
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0812Aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00Polymer mixtures characterised by way of preparation
    • C08L2314/08Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst
JP2022524364A 2020-05-22 2021-04-29 高熱伝導性シリコーン組成物 Active JP7371249B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020089709 2020-05-22
JP2020089709 2020-05-22
PCT/JP2021/017129 WO2021235214A1 (ja) 2020-05-22 2021-04-29 高熱伝導性シリコーン組成物

Publications (2)

Publication Number Publication Date
JPWO2021235214A1 true JPWO2021235214A1 (ja) 2021-11-25
JP7371249B2 JP7371249B2 (ja) 2023-10-30

Family

ID=78708545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524364A Active JP7371249B2 (ja) 2020-05-22 2021-04-29 高熱伝導性シリコーン組成物

Country Status (7)

Country Link
US (1) US20230167301A1 (ja)
EP (1) EP4155347A1 (ja)
JP (1) JP7371249B2 (ja)
KR (1) KR20230015340A (ja)
CN (1) CN115667407A (ja)
TW (1) TW202146579A (ja)
WO (1) WO2021235214A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023147698A1 (en) * 2022-02-07 2023-08-10 Dow Silicones Corporation Curable thermally conductive composition
KR102545636B1 (ko) * 2023-02-17 2023-06-21 주식회사 파인테크닉스 열전도성 복합신소재용 조성물, 이를 포함하는 등기구의 방열장치 및 등기구의 방열장치로 제작된 led 등기구

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256558A (ja) * 1999-03-11 2000-09-19 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及びその製造方法
WO2014181657A1 (ja) * 2013-05-07 2014-11-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2014188667A1 (ja) * 2013-05-24 2014-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2016011322A (ja) * 2014-06-27 2016-01-21 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
JP2016098337A (ja) * 2014-11-25 2016-05-30 信越化学工業株式会社 一液付加硬化型シリコーン組成物、その保存方法及び硬化方法
WO2017159252A1 (ja) * 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2018230189A1 (ja) * 2017-06-15 2018-12-20 信越化学工業株式会社 熱伝導性シリコーン組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP3922367B2 (ja) * 2002-12-27 2007-05-30 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN101265362A (zh) * 2008-05-07 2008-09-17 曲阜师范大学 一种功能稳定金属有机复合材料的加工方法
CN101294067B (zh) * 2008-06-20 2011-09-14 清华大学 一种导热硅脂组合物
JP2010013521A (ja) * 2008-07-02 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5843364B2 (ja) * 2012-08-13 2016-01-13 信越化学工業株式会社 熱伝導性組成物
JP5832983B2 (ja) * 2012-10-18 2015-12-16 信越化学工業株式会社 シリコーン組成物
JP6388072B2 (ja) * 2015-03-02 2018-09-12 信越化学工業株式会社 熱伝導性シリコーン組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256558A (ja) * 1999-03-11 2000-09-19 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及びその製造方法
WO2014181657A1 (ja) * 2013-05-07 2014-11-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2014188667A1 (ja) * 2013-05-24 2014-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2016011322A (ja) * 2014-06-27 2016-01-21 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
JP2016098337A (ja) * 2014-11-25 2016-05-30 信越化学工業株式会社 一液付加硬化型シリコーン組成物、その保存方法及び硬化方法
WO2017159252A1 (ja) * 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2018230189A1 (ja) * 2017-06-15 2018-12-20 信越化学工業株式会社 熱伝導性シリコーン組成物

Also Published As

Publication number Publication date
KR20230015340A (ko) 2023-01-31
WO2021235214A1 (ja) 2021-11-25
US20230167301A1 (en) 2023-06-01
TW202146579A (zh) 2021-12-16
CN115667407A (zh) 2023-01-31
EP4155347A1 (en) 2023-03-29
JP7371249B2 (ja) 2023-10-30

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