JPWO2021235167A1 - - Google Patents
Info
- Publication number
- JPWO2021235167A1 JPWO2021235167A1 JP2022524345A JP2022524345A JPWO2021235167A1 JP WO2021235167 A1 JPWO2021235167 A1 JP WO2021235167A1 JP 2022524345 A JP2022524345 A JP 2022524345A JP 2022524345 A JP2022524345 A JP 2022524345A JP WO2021235167 A1 JPWO2021235167 A1 JP WO2021235167A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/38—Interconnections, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020089650 | 2020-05-22 | ||
| PCT/JP2021/016256 WO2021235167A1 (ja) | 2020-05-22 | 2021-04-22 | 撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021235167A1 true JPWO2021235167A1 (https=) | 2021-11-25 |
| JPWO2021235167A5 JPWO2021235167A5 (https=) | 2023-02-03 |
Family
ID=78708561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022524345A Ceased JPWO2021235167A1 (https=) | 2020-05-22 | 2021-04-22 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12295196B2 (https=) |
| JP (1) | JPWO2021235167A1 (https=) |
| WO (1) | WO2021235167A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007294667A (ja) * | 2006-04-25 | 2007-11-08 | Fujifilm Corp | 固体撮像素子の製造方法および固体撮像素子 |
| US20100207033A1 (en) * | 2009-02-18 | 2010-08-19 | Yu-Cheng Chen | X-ray detector and fabrication method thereof |
| JP2011243945A (ja) * | 2010-03-19 | 2011-12-01 | Fujifilm Corp | 光電変換層積層型固体撮像素子及び撮像装置 |
| JP2013135123A (ja) * | 2011-12-27 | 2013-07-08 | Sony Corp | 半導体装置、半導体装置の製造方法、固体撮像装置および電子機器 |
| US20160049449A1 (en) * | 2014-08-18 | 2016-02-18 | Samsung Electronics Co., Ltd. | Image sensor having light guide members |
| JP2019121804A (ja) * | 2018-01-10 | 2019-07-22 | パナソニックＩｐマネジメント株式会社 | イメージセンサ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4972288B2 (ja) * | 2004-08-30 | 2012-07-11 | 富士フイルム株式会社 | 撮像素子 |
| KR100935771B1 (ko) * | 2007-11-28 | 2010-01-06 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
| JP5942275B2 (ja) * | 2011-08-02 | 2016-06-29 | パナソニックＩｐマネジメント株式会社 | 固体撮像装置 |
| JP5946132B2 (ja) | 2012-09-25 | 2016-07-05 | 富士フイルム株式会社 | 固体撮像素子の製造方法 |
| JP5737358B2 (ja) | 2013-10-22 | 2015-06-17 | セイコーエプソン株式会社 | 光電変換装置 |
| JP2019016667A (ja) | 2017-07-05 | 2019-01-31 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像装置 |
-
2021
- 2021-04-22 JP JP2022524345A patent/JPWO2021235167A1/ja not_active Ceased
- 2021-04-22 WO PCT/JP2021/016256 patent/WO2021235167A1/ja not_active Ceased
-
2022
- 2022-11-01 US US18/051,866 patent/US12295196B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007294667A (ja) * | 2006-04-25 | 2007-11-08 | Fujifilm Corp | 固体撮像素子の製造方法および固体撮像素子 |
| US20100207033A1 (en) * | 2009-02-18 | 2010-08-19 | Yu-Cheng Chen | X-ray detector and fabrication method thereof |
| JP2011243945A (ja) * | 2010-03-19 | 2011-12-01 | Fujifilm Corp | 光電変換層積層型固体撮像素子及び撮像装置 |
| JP2013135123A (ja) * | 2011-12-27 | 2013-07-08 | Sony Corp | 半導体装置、半導体装置の製造方法、固体撮像装置および電子機器 |
| US20160049449A1 (en) * | 2014-08-18 | 2016-02-18 | Samsung Electronics Co., Ltd. | Image sensor having light guide members |
| JP2019121804A (ja) * | 2018-01-10 | 2019-07-22 | パナソニックＩｐマネジメント株式会社 | イメージセンサ |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021235167A1 (ja) | 2021-11-25 |
| US12295196B2 (en) | 2025-05-06 |
| US20230114451A1 (en) | 2023-04-13 |
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