JPWO2021224982A1 - - Google Patents
Info
- Publication number
- JPWO2021224982A1 JPWO2021224982A1 JP2022519874A JP2022519874A JPWO2021224982A1 JP WO2021224982 A1 JPWO2021224982 A1 JP WO2021224982A1 JP 2022519874 A JP2022519874 A JP 2022519874A JP 2022519874 A JP2022519874 A JP 2022519874A JP WO2021224982 A1 JPWO2021224982 A1 JP WO2021224982A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Near-Field Transmission Systems (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/018638 WO2021224982A1 (ja) | 2020-05-08 | 2020-05-08 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021224982A1 true JPWO2021224982A1 (zh) | 2021-11-11 |
JP7278016B2 JP7278016B2 (ja) | 2023-05-19 |
Family
ID=78467968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022519874A Active JP7278016B2 (ja) | 2020-05-08 | 2020-05-08 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7278016B2 (zh) |
WO (1) | WO2021224982A1 (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109112A (ja) * | 2008-10-30 | 2010-05-13 | Hitachi Ltd | 半導体集積回路 |
JP2012169513A (ja) * | 2011-02-16 | 2012-09-06 | Keio Gijuku | 電子回路 |
WO2017010012A1 (ja) * | 2015-07-16 | 2017-01-19 | 株式会社PEZY Computing | 半導体装置 |
WO2017126018A1 (ja) * | 2016-01-18 | 2017-07-27 | ウルトラメモリ株式会社 | 半導体装置 |
WO2017138106A1 (ja) * | 2016-02-10 | 2017-08-17 | ウルトラメモリ株式会社 | 半導体装置 |
-
2020
- 2020-05-08 WO PCT/JP2020/018638 patent/WO2021224982A1/ja active Application Filing
- 2020-05-08 JP JP2022519874A patent/JP7278016B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109112A (ja) * | 2008-10-30 | 2010-05-13 | Hitachi Ltd | 半導体集積回路 |
JP2012169513A (ja) * | 2011-02-16 | 2012-09-06 | Keio Gijuku | 電子回路 |
WO2017010012A1 (ja) * | 2015-07-16 | 2017-01-19 | 株式会社PEZY Computing | 半導体装置 |
WO2017126018A1 (ja) * | 2016-01-18 | 2017-07-27 | ウルトラメモリ株式会社 | 半導体装置 |
WO2017138106A1 (ja) * | 2016-02-10 | 2017-08-17 | ウルトラメモリ株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2021224982A1 (ja) | 2021-11-11 |
JP7278016B2 (ja) | 2023-05-19 |
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