JPWO2021220922A1 - - Google Patents

Info

Publication number
JPWO2021220922A1
JPWO2021220922A1 JP2022512803A JP2022512803A JPWO2021220922A1 JP WO2021220922 A1 JPWO2021220922 A1 JP WO2021220922A1 JP 2022512803 A JP2022512803 A JP 2022512803A JP 2022512803 A JP2022512803 A JP 2022512803A JP WO2021220922 A1 JPWO2021220922 A1 JP WO2021220922A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022512803A
Other languages
Japanese (ja)
Other versions
JP7197055B2 (en
JPWO2021220922A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220922A1 publication Critical patent/JPWO2021220922A1/ja
Publication of JPWO2021220922A5 publication Critical patent/JPWO2021220922A5/ja
Application granted granted Critical
Publication of JP7197055B2 publication Critical patent/JP7197055B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/14—Esterification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2022512803A 2020-05-01 2021-04-22 Acid group-containing (meth)acrylate resin, curable resin composition, insulating material, resin material for solder resist, and resist member Active JP7197055B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020081120 2020-05-01
JP2020081120 2020-05-01
PCT/JP2021/016236 WO2021220922A1 (en) 2020-05-01 2021-04-22 Acid group-containing (meth)acrylate resin, curable resin composition, insulating material, resin material for solder resist, and resist member

Publications (3)

Publication Number Publication Date
JPWO2021220922A1 true JPWO2021220922A1 (en) 2021-11-04
JPWO2021220922A5 JPWO2021220922A5 (en) 2022-06-16
JP7197055B2 JP7197055B2 (en) 2022-12-27

Family

ID=78331537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512803A Active JP7197055B2 (en) 2020-05-01 2021-04-22 Acid group-containing (meth)acrylate resin, curable resin composition, insulating material, resin material for solder resist, and resist member

Country Status (5)

Country Link
JP (1) JP7197055B2 (en)
KR (1) KR20230004556A (en)
CN (1) CN115461381A (en)
TW (1) TW202208468A (en)
WO (1) WO2021220922A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012198527A (en) * 2011-03-04 2012-10-18 Toyo Ink Sc Holdings Co Ltd Photosensitive composition
JP2012211975A (en) * 2011-03-31 2012-11-01 Toyo Ink Sc Holdings Co Ltd Colored composition for color filter and color filter using the same
JP2013182174A (en) * 2012-03-02 2013-09-12 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition
JP2013210405A (en) * 2012-03-30 2013-10-10 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition
JP2014118418A (en) * 2012-12-13 2014-06-30 Nagase Chemtex Corp Silsesquioxane derivative and negative photosensitive resin composition using the same
JP2014210892A (en) * 2013-04-22 2014-11-13 昭和電工株式会社 (meth)acrylate polymer, composition comprising the polymer and application of the same
JP2016149388A (en) * 2015-02-10 2016-08-18 東洋インキＳｃホールディングス株式会社 Circuit board with electromagnetic wave shield film, and production method of the same
JP2020027215A (en) * 2018-08-16 2020-02-20 東洋インキＳｃホールディングス株式会社 Coloring composition for color filter, and color filter

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3543409B2 (en) 1995-03-24 2004-07-14 大日本インキ化学工業株式会社 Active energy ray-curable epoxy acrylate resin composition
JP2012215833A (en) * 2011-03-31 2012-11-08 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition and insulating film for touch panel
JP6028360B2 (en) * 2011-06-29 2016-11-16 東洋インキＳｃホールディングス株式会社 Photosensitive resin composition and cured product thereof, and method for producing photosensitive resin
JP2013076833A (en) * 2011-09-30 2013-04-25 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition and cured product of the same, and production method of photosensitive resin
JP2013137373A (en) * 2011-12-28 2013-07-11 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition and cured product of the same, and production method of photosensitive resin
JP2014130417A (en) * 2012-12-28 2014-07-10 Toppan Printing Co Ltd Front plate for touch panel, integrated-type sensor substrate equipped with the same and display device
JP6259240B2 (en) * 2013-09-30 2018-01-10 昭和電工株式会社 Photosensitive resin manufacturing method and color filter manufacturing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012198527A (en) * 2011-03-04 2012-10-18 Toyo Ink Sc Holdings Co Ltd Photosensitive composition
JP2012211975A (en) * 2011-03-31 2012-11-01 Toyo Ink Sc Holdings Co Ltd Colored composition for color filter and color filter using the same
JP2013182174A (en) * 2012-03-02 2013-09-12 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition
JP2013210405A (en) * 2012-03-30 2013-10-10 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition
JP2014118418A (en) * 2012-12-13 2014-06-30 Nagase Chemtex Corp Silsesquioxane derivative and negative photosensitive resin composition using the same
JP2014210892A (en) * 2013-04-22 2014-11-13 昭和電工株式会社 (meth)acrylate polymer, composition comprising the polymer and application of the same
JP2016149388A (en) * 2015-02-10 2016-08-18 東洋インキＳｃホールディングス株式会社 Circuit board with electromagnetic wave shield film, and production method of the same
JP2020027215A (en) * 2018-08-16 2020-02-20 東洋インキＳｃホールディングス株式会社 Coloring composition for color filter, and color filter

Also Published As

Publication number Publication date
WO2021220922A1 (en) 2021-11-04
CN115461381A (en) 2022-12-09
JP7197055B2 (en) 2022-12-27
TW202208468A (en) 2022-03-01
KR20230004556A (en) 2023-01-06

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