JPWO2021215518A1 - - Google Patents

Info

Publication number
JPWO2021215518A1
JPWO2021215518A1 JP2022517105A JP2022517105A JPWO2021215518A1 JP WO2021215518 A1 JPWO2021215518 A1 JP WO2021215518A1 JP 2022517105 A JP2022517105 A JP 2022517105A JP 2022517105 A JP2022517105 A JP 2022517105A JP WO2021215518 A1 JPWO2021215518 A1 JP WO2021215518A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022517105A
Other versions
JP7321366B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021215518A1 publication Critical patent/JPWO2021215518A1/ja
Application granted granted Critical
Publication of JP7321366B2 publication Critical patent/JP7321366B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2022517105A 2020-04-24 2021-04-22 ミラー装着部材、これを用いた位置計測用ミラー、露光装置および荷電粒子線装置 Active JP7321366B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020077461 2020-04-24
JP2020077461 2020-04-24
PCT/JP2021/016374 WO2021215518A1 (ja) 2020-04-24 2021-04-22 ミラー装着部材、これを用いた位置計測用ミラー、露光装置および荷電粒子線装置

Publications (2)

Publication Number Publication Date
JPWO2021215518A1 true JPWO2021215518A1 (ja) 2021-10-28
JP7321366B2 JP7321366B2 (ja) 2023-08-04

Family

ID=78269292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022517105A Active JP7321366B2 (ja) 2020-04-24 2021-04-22 ミラー装着部材、これを用いた位置計測用ミラー、露光装置および荷電粒子線装置

Country Status (3)

Country Link
JP (1) JP7321366B2 (ja)
KR (1) KR20220153070A (ja)
WO (1) WO2021215518A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240349A (en) * 1975-09-24 1977-03-29 Nasa Reflecting element and method of making same
JPH056850A (ja) * 1991-02-07 1993-01-14 Nikon Corp 露光装置
JPH0560909A (ja) * 1991-03-30 1993-03-12 Shinetsu Quartz Prod Co Ltd 軽量化反射鏡用基体及びその製造方法
JPH11209171A (ja) * 1998-01-21 1999-08-03 Kyocera Corp 緻密質低熱膨張セラミックス及びその製造方法、並びに半導体製造装置用部材
JP2004177331A (ja) * 2002-11-28 2004-06-24 Taiheiyo Cement Corp 位置測定用ミラーおよびミラー用部材

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2691865B2 (ja) 1994-03-18 1997-12-17 株式会社ソルテック 極紫外線縮小投影露光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240349A (en) * 1975-09-24 1977-03-29 Nasa Reflecting element and method of making same
JPH056850A (ja) * 1991-02-07 1993-01-14 Nikon Corp 露光装置
JPH0560909A (ja) * 1991-03-30 1993-03-12 Shinetsu Quartz Prod Co Ltd 軽量化反射鏡用基体及びその製造方法
JPH11209171A (ja) * 1998-01-21 1999-08-03 Kyocera Corp 緻密質低熱膨張セラミックス及びその製造方法、並びに半導体製造装置用部材
JP2004177331A (ja) * 2002-11-28 2004-06-24 Taiheiyo Cement Corp 位置測定用ミラーおよびミラー用部材

Also Published As

Publication number Publication date
JP7321366B2 (ja) 2023-08-04
WO2021215518A1 (ja) 2021-10-28
KR20220153070A (ko) 2022-11-17

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